RIGIFLEX DESIGN RULES
| Description | Use A Static (FR4)/Soldermask Flex | Use B dynamic (PolyImide) | |
| minimum plated through hole B | 
|
0.15 mm | 0.15 mm |
| minimum pad diameter A | 
|
minimum pad diameter B + 150µm | minimum pad diameter B + 260µm |
| minimum length from plated through hole to flex | 
|
0.8 mm | 0.8 mm |
| Copper distance to Rigiflex intersection | 
|
350 µm | 800 µm |
| Copper distance to Rigiflex intersection | 
|
≥ 200 µm | ≥ 250 µm |
| minimum length of flex area | 
|
≥ 2.0 mm | ≥ 2.0 mm |
| Distance track-flex outline | 
|
≥ 350 µm | ≥ 350 µm |
| minimum bending radius | 
|
5 mm | 3.2 mm |
| Minimum Signal inner layer annular ring | 
|
0.125 mm | 0.19 mm |
| Minimum distance form Rigid to Flex | 
|
1.0 mm | 1.0 mm |
| Minimum distance from ZIF connector to Flex | 
|
> 2 mm | - |
| max. quantity of bending cycles with min. bending radius |  |
10 with radius 5.0 mm | 6000 s/IPC-TM-650 2.4.3 |
| Thickness of flex material | |
75, 100 µm | 50 µm standard (25,75,100,125,150 on demand) |
| Cu thickness of flex layers | |
17, 35 µm | 17, 35, 70 µm |
| Thickness of coverlayer IPC-4203/1 | |
25 µm | 25 µm |
| Max. number of flex layers | |
2 | 8 |
| General tolerances | |
Class 7 Lab Circuits | Class 7, Annular Ring class 5
|
| Maximum PCB size | |
530 x 400 mm | 530 x 400 mm |
Last update: 06-04-2023 Units: Milimeters |
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