Materials | STANDARD | SPECIALIZED | |
Materials | FR4,High Tg, High frequency,PI
|
- | |
Multilayer | from 2 to 30 layers | - | |
PCB final thickness | de 32 a 126 mil | 20 and 158 mils | |
Maximum PCB size | 22.4 x 19,7
|
23.5 x 15.5 | |
min. Trace / Space | 3/3 mil | - | |
Base copper thickness | ½,1,2,3 oz | - | |
min. Finished hole size | 6 mil | - | |
Drills | thru-hole,blind, buried, microvia, castellated pleted holes and backdrill. | - | |
Microvies | 3 and 4 mils | - | |
Resin filling vias/microvias | Taiyo THP-100DX non-conductive resin | - | |
Copper filling microvias | Microvia filling with copper | - | |
Scoring | Yes | - | |
PCB surface finish | IAg, ENIG , HAL Lead Free, Hal Tin Lead, Hard Gold Edge Connectors and Graphite | Immersion Tin | |
Photoimageable Solder Mask, legend and peelable ink | Yes | - | |
Controlled Impedance
(previous analysis design) |
10% | <10% | |
UL listed | Yes FR4 | - | |
Rigiflex | static and dynamic. | - | |
IPCA600 | CLASS 2 | CLASS 3,3A * |
Last update: 06-06-2023 Units: Mils |
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