Materials | STANDARD | SPECIALIZED | |
Materials | ![]() |
FR4,High Tg, High frequency,PI
|
- |
Multilayer | ![]() |
from 2 to 30 layers | - |
PCB final thickness | ![]() |
de 32 a 126 mil | 20 and 158 mils |
Maximum PCB size | ![]() |
22.4 x 19,7
|
23.5 x 15.5 |
min. Trace / Space | ![]() |
3/3 mil | - |
Base copper thickness | ![]() |
½,1,2,3 oz | - |
min. Finished hole size | ![]() |
6 mil | - |
Drills | ![]() |
thru-hole,blind and buried. | - |
Microvies | ![]() |
3 and 4 mils | - |
Scoring | ![]() |
Yes | - |
PCB surface finish | ![]() |
IAg, ENIG , HAL Lead Free, Hal Tin Lead, Hard Gold Edge Connectors and Graphite | Immersion Tin |
Photoimageable Solder Mask, legend and peelable ink | ![]() |
Yes | - |
Controlled Impedance
(previous analysis design) |
![]() |
10% | <10% |
UL listed | ![]() |
Yes FR4 | - |
Rigiflex | ![]() |
static and dynamic. | - |
IPCA600 | ![]() |
CLASS 2 | CLASS 3,3A * |
Last update: 23-06-2016 Units: Mils |
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