STANDARD | SPECIALIZED | ||
Materials | FR4,Alt Tg, High frequency ,PI | - | |
No. Layers | from 2 to 32 | - | |
PCB final thickness | de 0.8 a 3.2 mm. | 0,5 and 4 mm. | |
Maximum PCB size | 570 mm x 500 mm | 600x400 mm | |
Minimum Track / Space | 0.075/0.075 mm | - | |
Base copper thickness | 17,35,70,105 µm | - | |
Minimum Finished hole | 0.15 mm | - | |
Drills | thru-hole, blind, buried, microvia, castellated plated holes and backdrill. | - | |
Microvias | 75 µm amd 100 µm | - | |
Resin filling vias/microvias | Taiyo THP-100DX non-conductive resin | - | |
Copper filling microvias | Microvia filling with copper | - | |
Scoring | Yes | - | |
PCB surface finish | ImAg
ENIG HAL Lead Free HAL Tin Lead Hard Gold Edge Connectors Graphite |
ENEPIG
EPIG ImSn |
|
Photoimageable Solder Mask, legend and peelable ink | Yes | - | |
Controlled Impedance
(previous analysis design) |
10% | <10% | |
UL listed | Yes in FR4 | - | |
Rigiflex | static and dynamic. | - | |
IPCA600 | CLASS 2 | CLASS 3,3A * |
Last update: 07-06-2023 Units: Milimeters |
|