MANUFACTURING CAPABILITIES
| STANDARD | SPECIALIZED | ||
| Materials |  |
FR4,Alt Tg, High frequency ,PI | - |
| No. Layers | |
from 2 to 32 | - |
| PCB final thickness | |
de 0.8 a 3.2 mm. | 0,5 and 4 mm. |
| Maximum PCB size | |
570 mm x 500 mm | 600x400 mm |
| Minimum Track / Space | |
0.075/0.075 mm | - |
| Base copper thickness | |
17,35,70,105 µm | - |
| Minimum Finished hole | |
0.15 mm | - |
| Drills | |
thru-hole, blind, buried, microvia, castellated plated holes and backdrill. | - |
| Microvias | |
75 µm amd 100 µm | - |
| Resin filling vias/microvias | |
Taiyo THP-100DX non-conductive resin | - |
| Copper filling microvias | |
Microvia filling with copper | - |
| Scoring | |
Yes | - |
| PCB surface finish | |
ImAg
ENIG HAL Lead Free HAL Tin Lead Hard Gold Edge Connectors Graphite |
ENEPIG
EPIG ImSn |
| Photoimageable Solder Mask, legend and peelable ink | |
Yes | - |
| Controlled Impedance
(previous analysis design) |
|
10% | <10% |
| UL listed | |
Possible in FR4 150 and 175ºC Tg / Rigiflex | - |
| Rigiflex | |
static and dynamic. | - |
| IPCA600 | |
CLASS 2 | CLASS 3,3A * |
Last update: 07-10-2025 Units: Milimeters |
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