STANDARD | SPECIAL | ||
Outer layer trace / spacing width | ![]() |
±20% (½ oz )
±25% (1-2 oz ) |
±10% (½ oz )
±15% (1 - 2 oz) |
Inner layer trace / spacing width | ![]() |
±20% (½ - 1 oz)
±25% (2 oz) |
±10% (½ oz )
±15% (1 - 2 oz ) |
Plated hole diameter | ![]() |
+4 mil / -2 mil
(or equivalent) |
+4 mil / -0,0 mil
±2 mil |
Non plated hole diameter | ![]() |
+4 mil / -0,0 mil
(or equivalent) |
±1.4 mil
(or equivalent) |
Castellated plated holes | ![]() |
Total thickness circuit.....................>= 0,02 mil
Cross annular ring.......... detall - A >= 0,02 mil Minimum diameter..........detall - B >= 0,02 mil Longitudinal annular...... detall - C >= 0,006 mil Annular separation.........detall - D >= 0,006 mil Edge separation..............detall - E >= 0,08 mil |
- |
Backdrill | ![]() |
Min. hole backdrill 0.5mm
More parameters see image |
- |
Scoring to copper clearance | ![]() |
Min. 40 mil. | Min. 30 mil |
Scoring positioning | ![]() |
± 4 mil | ± 3 mil |
Scoring remaining thickness | ![]() |
± 4 mil
|
± 2 mil
|
Board size | ![]() |
± 6 mil.
|
± 4 mil. |
Total thickness tolerance | ![]() |
±10 % | ±5 % |
Dielectric thickness | ![]() |
±10 % | ±5 % |
Finished plated hole copper thickness | ![]() |
Average: 0.7 oz
Minimum: 0.6 oz |
Average: 1 oz
Minimum: 0.86 oz |
Blind/buried plated hole copper thickness | ![]() |
Average: 0.4 oz.
Minimum: 0.37 oz. |
Average : 0.7 oz.
Minimum: 0.6 oz. |
Microvia Plated hole copper thickness | ![]() |
Average: 0.4 oz.
Minimum:0.37 oz. |
Average: 0.7 oz.
Minimum: 0.6 oz. |
Mínimum wall between same net plated through holes | ![]() |
12 mil. | 10 mil. |
Minimum wall between different net plated through holes | ![]() |
16 mil. | 14 mil. |
Minimum wall between non plated thruough holes | ![]() |
10 mil. | 8 mil. |
Minimum annular ring non plated hole | ![]() |
10 mil.
|
8 mil. |
Track to non plated through hole minimum spacing | ![]() |
8 mil. | 6 mil. |
Track to board edge minimum spacing | ![]() |
8 mil. | 6 mil. |
Offset between board edge and drill | ![]() |
Max. 6 mil.
|
Max. 4 mil.
|
Offset between drill to outlayer pad | ![]() |
Max. 4 mil.
|
Max. 3 mil.
|
Offset between drill to innerlayer pad | ![]() |
Max. 6 mil. | Max. 5 mil.
|
Offset between layers | ![]() |
Max. 4 mil.
|
Max. 3 mil.
|
Soldermask feature tolerance | ![]() |
Max. 6 mil. | Max. 3 mil. |
Soldermask min Dam size | ![]() |
3.15 mil. green color
other colors on request |
-- |
Photoimageable soldermask clearance | ![]() |
2.5 mil. | -- |
Silkscreened soldermask clearance | ![]() |
8 mil. | 6 mil. |
Legend minimum line | ![]() |
5 mil. | 4 mil. |
Conductive ink (graphite) overlapping | ![]() |
8 mil.
|
5 mil. |
Conductive ink (graphite) spacing | ![]() |
20 mil. | 16 mil. |
Conductive ink to pad spacing | ![]() |
16 mil. | 12 mil. |
Peel-off mask overlapping | ![]() |
32 mil. | 20 mil. |
Peel-off mask to pad spacing | ![]() |
40 mil. | 28 mil. |
Peel-off mask to board
edge spacing |
![]() |
40 mil. | 28 mil. |
Maximum peel-off mask filled hole | ![]() |
71 mil. | 79 mil. |
Bow and twist | ![]() |
Maxim 1% | Maxim 0,5 % |
Insulation resistance | ![]() |
Minimum 0,5 MOhm | Minimum 2,0 MOhm |
Continuity | ![]() |
Maxim 10 Ohms | - |
Ionic contamination | ![]() |
Max. 0.4 µg Eq. NaCl/cm² | Max. 0.4 µg Eq. NaCl/cm² |
Other features | ![]() |
See spec.
IPC-A-600 Rev K jul-20 |
- |
Last update: 22-02-2022 Units: Mils |