PARAMETERS MANUFACTURE MULTILAYER
CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter Ver esquema... 0,50 mm
0,30 mm 0,30 mm
0,20 mm 0,15 mm
Minimum non plated through hole diameter Ver esquema... 0,60 mm 0,40 mm 0,40 mm 0,30 mm 0,25 mm
Aspect / Ratio Ver esquema... 5 5 6 8 13 (maximun
thickness 2 mm)
Minimum outerlayer trace / spacing width Ver esquema... 0,30 mm (17 µ m)
0,30 mm (35 µ m)
0,35 mm (70 µ m)
0,20 mm (17 µ m)
0,20 mm (35 µ m)
0,25 mm (70 µ m)
0,15 mm (17 µ m)
0,15 mm (35 µ m)
0,20 mm (70 µ m)
0,125 mm (17 µm)
0,15 mm (35 µm)
0,175 mm (70 µm)
0,100 mm (17 µ)
Minimum innerlayer trace / spacing width Ver esquema... 0,25 mm (17 µ m)
0,30 mm (35 µ m)
0,30 mm (70 µ m)
0,15 mm (17 µ m)
0,20 mm (35 µ m)
0,20 mm (70 µ m)
0,125 mm (17 µ m)
0,15 mm (35 µ m)
0,175 mm (70 µ m)
0,10 mm (17 µ m)
0,125 mm (35 µ m)
0,15 mm (70 µ m)
0,075 mm (17 µ m)
0,100 mm (35 µ m)
Minimum Outer layer annular ring Ver esquema... 0.22 mm 0.17 mm 0.13 mm 0.10 mm 0.075 mm
Minimum Signal inner layer annular ring Ver esquema... 0.25 mm 0.22 mm 0.19 mm 0.15 mm 0.125 mm
Minimum annular spacing in ground plane Ver esquema... 0.40 mm 0.40 mm 0.30 mm 0.25 mm 0.20 mm
Minimum microvia diameter Ver esquema... 0,10 mm
(max. thickness 0.1 mm)
0,075 mm
(max. thickness 0.065 mm)
0,075 mm
(max. thickness
0.065 mm)
Microvia surface pad Ver esquema... 0.35 mm 0.30 mm 0.25 mm
Microvia landing pad Ver esquema... 0.30 mm 0.25 mm 0.25 mm
Minimum wall between
microvia and thru hole / blind/ buried
Ver esquema... 0.22 mm 0.15 mm 0.10 mm
Minimum wall between microvias Ver esquema... 0.23 mm 0.15 mm 0.10 mm
Minimum wall between microvias in two levels Ver esquema... 0.23 mm 0.15 mm 0.10 mm


Last update: 13-02-2012
Units: Milimeters