PARAMETERS MANUFACTURE MULTILAYER
CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter Ver esquema... 0,50 mm
0,30 mm 0,30 mm
0,20 mm 0,15 mm
Minimum non plated through hole diameter Ver esquema... 0,60 mm 0,40 mm 0,40 mm 0,30 mm 0,25 mm
Aspect / Ratio Ver esquema... 5 5 6 8 13 (maximun
thickness 2 mm)
Minimum outerlayer trace / spacing width (base copper thickness) Ver esquema... 0,300 mm (17 µ m)
0,300 mm (35 µ m)
0,350 mm (70 µ m)
0,350 mm (105 µm)
0,200 mm (17 µ m)
0,200 mm (35 µ m)
0,250 mm (70 µ m)
0,300 mm (105 µm)
0,150 mm (17 µ m)
0,150 mm (35 µ m)
0,200 mm (70 µ m)
0,250 mm (105 µm)
0,125 mm (17 µm)
0,150 mm (35 µm)
0,175 mm (70 µm)
0,200 mm (105 µm)
0,100 mm (17 µ)
Minimum innerlayer trace / spacing width (base copper thickness) Ver esquema... 0,250 mm (17 µ m)
0,300 mm (35 µ m)
0,300 mm (70 µ m)
0,350 mm (105 µm)
0,150 mm (17 µ m)
0,200 mm (35 µ m)
0,200 mm (70 µ m)
0,300 mm (105 µm)
0,125 mm (17 µ m)
0,150 mm (35 µ m)
0,175 mm (70 µ m)
0,250 mm (105 µm)
0,100 mm (17 µ m)
0,125 mm (35 µ m)
0,150 mm (70 µ m)
0,200 mm (105 µm)
0,075 mm (17 µ m)
0,100 mm (35 µ m)
Minimum Outer layer annular ring Ver esquema... 0.22 mm 0.17 mm 0.13 mm 0.10 mm 0.075 mm
Minimum Signal inner layer annular ring Ver esquema... 0.25 mm 0.22 mm 0.19 mm 0.15 mm 0.125 mm
Minimum annular spacing in ground plane Ver esquema... 0.40 mm 0.40 mm 0.30 mm 0.25 mm 0.20 mm
Minimum microvia diameter Ver esquema... 0,10 mm
(max. thickness 0.1 mm)
0,075 mm
(max. thickness 0.065 mm)
0,075 mm
(max. thickness
0.065 mm)
Microvia surface pad Ver esquema... 0.35 mm 0.30 mm 0.25 mm
Microvia landing pad Ver esquema... 0.30 mm 0.25 mm 0.25 mm
Minimum wall between
microvia and thru hole / blind/ buried
Ver esquema... 0.22 mm 0.15 mm 0.10 mm
Minimum wall between microvias Ver esquema... 0.23 mm 0.15 mm 0.10 mm
Minimum wall between microvias in two levels Ver esquema... 0.23 mm 0.15 mm 0.10 mm
Copper filling microvias Ver esquema... - - - - -
Resin filling vias/microvias spacer - - - -


Last update: 28-04-2023
Units: Milimeters