PARAMETERS MANUFACTURE MULTILAYER
| CLASS 3 | CLASS 4 | CLASS 5 | CLASS 6 | CLASS 7 | ||
| Minimum plated through hole diameter | 
|
0,50 mm
|
0,30 mm | 0,30 mm
|
0,20 mm | 0,15 mm |
| Minimum non plated through hole diameter | 
|
0,60 mm | 0,40 mm | 0,40 mm | 0,30 mm | 0,25 mm |
| Aspect / Ratio | 
|
5 | 5 | 6 | 8 | 13 (maximun
thickness 2 mm) |
| Minimum outerlayer trace / spacing width | 
|
0,30 mm (17 µ m)
0,30 mm (35 µ m) 0,35 mm (70 µ m) |
0,20 mm (17 µ m)
0,20 mm (35 µ m) 0,25 mm (70 µ m) |
0,15 mm (17 µ m)
0,15 mm (35 µ m) 0,20 mm (70 µ m) |
0,125 mm (17 µm)
0,15 mm (35 µm) 0,175 mm (70 µm) |
0,100 mm (17 µ) |
| Minimum innerlayer trace / spacing width | 
|
0,25 mm (17 µ m)
0,30 mm (35 µ m) 0,30 mm (70 µ m) |
0,15 mm (17 µ m)
0,20 mm (35 µ m) 0,20 mm (70 µ m) |
0,125 mm (17 µ m)
0,15 mm (35 µ m) 0,175 mm (70 µ m) |
0,10 mm (17 µ m)
0,125 mm (35 µ m) 0,15 mm (70 µ m) |
0,075 mm (17 µ m)
0,100 mm (35 µ m) |
| Minimum Outer layer annular ring | 
|
0.22 mm | 0.17 mm | 0.13 mm | 0.10 mm | 0.075 mm |
| Minimum Signal inner layer annular ring | 
|
0.25 mm | 0.22 mm | 0.19 mm | 0.15 mm | 0.125 mm |
| Minimum annular spacing in ground plane | 
|
0.40 mm | 0.40 mm | 0.30 mm | 0.25 mm | 0.20 mm |
| Minimum microvia diameter | 
|
0,10 mm
(max. thickness 0.1 mm) |
0,075 mm
(max. thickness 0.065 mm) |
0,075 mm
(max. thickness 0.065 mm) |
||
| Microvia surface pad | 
|
0.35 mm | 0.30 mm | 0.25 mm | ||
| Microvia landing pad | 
|
0.30 mm | 0.25 mm | 0.25 mm | ||
| Minimum wall between
microvia and thru hole / blind/ buried |
|
0.22 mm | 0.15 mm | 0.10 mm | ||
| Minimum wall between microvias | 
|
0.23 mm | 0.15 mm | 0.10 mm | ||
| Minimum wall between microvias in two levels | 
|
0.23 mm | 0.15 mm | 0.10 mm |
Last update: 13-02-2012 Units: Milimeters |