MULTILAYER GENERAL TOLERANCES
| STANDARD | SPECIAL | ||
| Outer layer trace / spacing width | 
|
±25% (35-70 µm)
±20% (17 µm ) |
±15% (35-70 µm)
±10% (17 µm) |
| Inner layer trace / spacing width | 
|
±25% (70 µm )
±20% (17-35 µm ) |
±15% (35-70 µm)
±10% (17 µm) |
| Plated hole diameter | 
|
+0,10 mm / -0,05 mm
(or equivalent) |
+0,10 mm / -0,0 mm
(or equivalent) |
| Non plated hole diameter | 
|
+0,10 mm / -0,0 mm
(or equivalent) |
±0,035 mm
(or equivalent) |
| Castellated plated holes | 
|
Total thickness circuit.....................>= 0,5 mm
Cross annular ring.......... detall - A >= 0,5 mm Minimum diameter..........detall - B >= 0,5 mm Longitudinal annular...... detall - C >= 0,15 mm Annular separation.........detall - D >= 0,15 mm Edge separation..............detall - E >= 2 mm |
- |
| Backdrill | 
|
Min. hole backdrill 0.5mm
More parameters see image |
-- |
| Scoring to copper clearance | 
|
Min. 1,0 mm. | Min. 0,75 mm. |
| Scoring positioning | 
|
±0,10 mm | ±0,075 mm |
| Scoring remaining thickness | 
|
±0,15 mm
|
±0,075 mm
|
| Board size | 
|
± 0,15 mm.
|
± 0,10 mm. |
| Total thickness tolerance | 
|
±10 % | ±5 % |
| Dielectric thickness | 
|
±10 % | ±5 % |
| Finished plated hole copper thickness | 
|
Average: 25 µm
Minim: 20 µm |
Average: 35 µm
Mínim: 30 µm |
| Blind/buried plated hole copper thickness | 
|
Average: 15 µm
Minimum: 13 µm |
Average: 25 µm
Minimum: 20 µm |
| Microvia Plated hole copper thickness | 
|
Average: 12 µm
Minimum:10 µm |
Average: 12 µm
Minimum:10 µm |
| Mínimum wall between same net plated through holes | 
|
0.30 mm | 0.25 mm |
| Minimum wall between different net plated through holes | 
|
0,40 mm. | 0,35 mm. |
| Minimum wall between non plated thruough holes | 
|
0,25 mm. | 0,20 mm. |
| Minimum annular ring non plated hole | 
|
0,25 mm
|
0,20 mm
|
| Track to non plated through hole minimum spacing | 
|
0,20 mm
|
0,15 mm
|
| Track to board edge minimum spacing | 
|
0,20 mm
|
0,15 mm
|
| Offset between board edge and drill | 
|
Max. 0,15 mm.
|
Max. 0,10 mm.
|
| Offset between drill to outlayer pad | 
|
Max. 0,10 mm.
|
Max. 0,075 mm.
|
| Offset between drill to innerlayer pad |
|
Max. 0,15 mm. | Max. 0,12 mm.
|
| Offset between layers | 
|
Max. 0,10 mm.
|
Max. 0,075 mm.
|
| Soldermask feature tolerance | 
|
Max. 0,15 mm. | Max. 0,075 mm. |
| Soldermask min Dam size | 
|
0.08 mm green color
other colors on request |
-- |
| Photoimageable soldermask clearance | 
|
0.06 mm | -- |
| Silkscreened soldermask clearance |
|
0,20 mm
|
0,15 mm
|
| Legend minimum line | 
|
0,125 mm
|
0,10 mm
|
| Conductive ink (graphite) overlapping | 
|
0,20 mm
|
0,125 mm
|
| Conductive ink (graphite) spacing | 
|
0,50 mm | 0,40 mm |
| Conductive ink to pad spacing | 
|
0,40 mm | 0,30 mm |
| Peel-off mask overlapping | 
|
0.8 mm
|
0,50 mm
|
| Peel-off mask to pad spacing | 
|
1 mm | 0,70 mm |
| Peel-off mask to board
edge spacing |
|
1 mm | 0,70 mm |
| Maximum peel-off mask filled hole | 
|
1.80 mm | 2 mm |
| Bow and twist |  |
Maxim 1% | Maxim 0,5 % |
| Insulation resistance | |
Minim 0,5 MOhm | Minim 2,0 MOhm |
| Continuity | |
Maxim 10 Ohms | - |
| Ionic contamination | |
Max. 0.4 µg Eq. NaCl/cm² | Max. 0.4 µg Eq. NaCl/cm² |
| Other features | |
See spec.
IPC-A-600 Rev K jul-20 |
- |
Last update: 22-02-2022 Units: Milimeters |