STANDARD | SPECIAL | ||
Outer layer trace / spacing width | ![]() |
±25% (35-70 µm)
±20% (17 µm ) |
±15% (35-70 µm)
±10% (17 µm) |
Inner layer trace / spacing width | ![]() |
±25% (70 µm )
±20% (17-35 µm ) |
±15% (35-70 µm)
±10% (17 µm) |
Plated hole diameter | ![]() |
+0,10 mm / -0,05 mm
(or equivalent) |
+0,10 mm / -0,0 mm
(or equivalent) |
Non plated hole diameter | ![]() |
+0,10 mm / -0,0 mm
(or equivalent) |
±0,035 mm
(or equivalent) |
Castellated plated holes | ![]() |
Total thickness circuit.....................>= 0,5 mm
Cross annular ring.......... detall - A >= 0,5 mm Minimum diameter..........detall - B >= 0,5 mm Longitudinal annular...... detall - C >= 0,15 mm Annular separation.........detall - D >= 0,15 mm Edge separation..............detall - E >= 2 mm |
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Backdrill | ![]() |
Min. hole backdrill 0.5mm
More parameters see image |
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Scoring to copper clearance | ![]() |
Min. 1,0 mm. | Min. 0,75 mm. |
Scoring positioning | ![]() |
±0,10 mm | ±0,075 mm |
Scoring remaining thickness | ![]() |
±0,15 mm
|
±0,075 mm
|
Board size | ![]() |
± 0,15 mm.
|
± 0,10 mm. |
Total thickness tolerance | ![]() |
±10 % | ±5 % |
Dielectric thickness | ![]() |
±10 % | ±5 % |
Finished plated hole copper thickness | ![]() |
Average: 25 µm
Minim: 20 µm |
Average: 35 µm
Mínim: 30 µm |
Blind/buried plated hole copper thickness | ![]() |
Average: 15 µm
Minimum: 13 µm |
Average: 25 µm
Minimum: 20 µm |
Microvia Plated hole copper thickness | ![]() |
Average: 12 µm
Minimum:10 µm |
Average: 12 µm
Minimum:10 µm |
Mínimum wall between same net plated through holes | ![]() |
0.30 mm | 0.25 mm |
Minimum wall between different net plated through holes | ![]() |
0,40 mm. | 0,35 mm. |
Minimum wall between non plated thruough holes | ![]() |
0,25 mm. | 0,20 mm. |
Minimum annular ring non plated hole | ![]() |
0,25 mm
|
0,20 mm
|
Track to non plated through hole minimum spacing | ![]() |
0,20 mm
|
0,15 mm
|
Track to board edge minimum spacing | ![]() |
0,20 mm
|
0,15 mm
|
Offset between board edge and drill | ![]() |
Max. 0,15 mm.
|
Max. 0,10 mm.
|
Offset between drill to outlayer pad | ![]() |
Max. 0,10 mm.
|
Max. 0,075 mm.
|
Offset between drill to innerlayer pad | ![]() |
Max. 0,15 mm. | Max. 0,12 mm.
|
Offset between layers | ![]() |
Max. 0,10 mm.
|
Max. 0,075 mm.
|
Soldermask feature tolerance | ![]() |
Max. 0,15 mm. | Max. 0,075 mm. |
Soldermask min Dam size on fiber | ![]() |
SOLDERMASK GREEN COLOR
Dam 70µm if final copper thickness is 17÷54µm. Dam 85µm if final copper thickness is 55÷85µm. Dam 105µm if final copper thickness is 86÷155µm. SOLDERMASK WHITE COLOR Dam 110µm if final copper thickness is 17÷54µm. Dam 110µm if final copper thickness is 55÷85µm. Other final copper thickness > 85µm, to consult. OTHER SOLDERMASK COLORS Dam 80µm if final copper thickness is 17÷54µm. Dam 95µm if final copper thickness is 55÷85µm. Dam 105µm if final copper thickness is 86÷155µm. |
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Soldermask min Dam size on copper | ![]() |
SOLDERMASK GREEN COLOR
Dam 60µm if final copper thickness is 17÷54µm. Dam 70µm if final copper thickness is 55÷85µm. Dam 85µm if final copper thickness is 86÷155µm. SOLDERMASK WHITE COLOR Dam 110µm if final copper thickness is 17÷54µm. Dam 110µm if final copper thickness is 55÷85µm. Other final copper thickness > 85µm, to consult. OTHER SOLDERMASK COLORS Dam 70µm if final copper thickness is 17÷54µm. Dam 80µm if final copper thickness is 55÷85µm. Dam 90µm if final copper thickness is 86÷155µm. |
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Photoimageable soldermask clearance | ![]() |
0.06 mm | -- |
Silkscreened soldermask clearance | ![]() |
0,20 mm
|
0,15 mm
|
Legend minimum line | ![]() |
0,125 mm
|
0,10 mm
|
Conductive ink (graphite) overlapping | ![]() |
0,20 mm
|
0,125 mm
|
Conductive ink (graphite) spacing | ![]() |
0,50 mm | 0,40 mm |
Conductive ink to pad spacing | ![]() |
0,40 mm | 0,30 mm |
Peel-off mask overlapping | ![]() |
0.8 mm
|
0,50 mm
|
Peel-off mask to pad spacing | ![]() |
1 mm | 0,70 mm |
Peel-off mask to board
edge spacing |
![]() |
1 mm | 0,70 mm |
Maximum peel-off mask filled hole | ![]() |
1.80 mm | 2 mm |
Bow and twist | ![]() |
Maxim 1% | Maxim 0,5 % |
Insulation resistance | ![]() |
Minim 0,5 MOhm | Minim 2,0 MOhm |
Continuity | ![]() |
Maxim 10 Ohms | - |
Ionic contamination | ![]() |
Max. 0.4 µg Eq. NaCl/cm² | Max. 0.4 µg Eq. NaCl/cm² |
Other features | ![]() |
See spec.
IPC-A-600 Rev K jul-20 |
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Last update: 13-06-2023 Units: Milimeters |