To achieve the objective to introduce the class 7 the second quarter of the 2007, important investments have been done in new machinery:
In the months of February-March we have acquired two new developers, one for dry-film and another for soldermask. The two machines are prepared for HDI circuits (High Density Interconect).
A new machine has been installed to improve Layer to layer misalignment in multilayer constructions.
At the end of the present month is arriving a new exposure machine for soldermask with for 4 points optical alignment, that guarantees better registration between image and soldermask.
Finally, another moving probe fixtureless tester machine prepared for high density circuits has been acquired, to guarantee the commitments of delivery times acquired with our customers.