From its beginnings up to date, the constant modernization of the production systems, have placed Lab Circuits in an outstanding position in the European printed circuit boards manufacturing industry
With 20.000 m2 manufactured circuits a year, set aside for telecommunications, industry control, etc. Lab Circuits has acquired great experience in the manufacture of double sided printed circuit boards and multilayer printed circuit boards, being able to offer a high quality product with excellent delivery terms.
The manufacture of high complexity prototypes must be pointed out, as well as the efficiency in the manufacture of medium size series of the circuits we have referenced above.
The modern installations built in 1994, designed to achieve the best system for printed circuit boards manufacture, allows to products with high technology: pcb HDI, Rigiflex, RoHS, microvias-laser, buried routes, impedance certification and special materials pcb's
In Lab Circuits, research, production flow modernization and the training of our human team, are basic foundations to achieve the high entreaties of nowadays electronic industry and futures
STANDARD | SPECIALIZED | ||
---|---|---|---|
Materials | ![]() |
FR4,Alt Tg, High frequency ,PI | - |
No. Layers | ![]() |
from 2 to 32 | - |
PCB final thickness | ![]() |
de 0.8 a 3.2 mm. | 0,5 and 4 mm. |
Maximum PCB size | ![]() |
570 mm x 500 mm | 600x400 mm |
Minimum Track / Space | ![]() |
0.075/0.075 mm | - |
Base copper thickness | ![]() |
17,35,70,105 µm | - |
Minimum Finished hole | ![]() |
0.15 mm | - |
Drills | ![]() |
thru-hole, blind, buried, microvia, castellated plated holes and backdrill. | - |
Microvias | ![]() |
75 µm amd 100 µm | - |
Resin filling vias/microvias | ![]() |
Taiyo THP-100DX non-conductive resin | - |
Copper filling microvias | ![]() |
Microvia filling with copper | - |
Scoring | ![]() |
Yes | - |
PCB surface finish | ![]() |
IAg, ENIG , HAL Lead Free,
Hal Tin Lead, Hard Gold Edge Connectors and Graphite |
Immersion Tin |
Photoimageable Solder Mask, legend and peelable ink | ![]() |
Yes | - |
Controlled Impedance
(previous analysis design) |
![]() |
10% | <10% |
UL listed | ![]() |
Yes in FR4 | - |
Rigiflex | ![]() |
static and dynamic. | - |
IPCA600 | ![]() |
CLASS 2 | CLASS 3,3A * |
Last update: 07-06-2023
Units: Milimeters
Materials | STANDARD | SPECIALIZED | |
---|---|---|---|
Materials | ![]() |
FR4,High Tg, High frequency,PI
|
- |
Multilayer | ![]() |
from 2 to 30 layers | - |
PCB final thickness | ![]() |
de 32 a 126 mil | 20 and 158 mils |
Maximum PCB size | ![]() |
22.4 x 19,7
|
23.5 x 15.5 |
min. Trace / Space | ![]() |
3/3 mil | - |
Base copper thickness | ![]() |
½,1,2,3 oz | - |
min. Finished hole size | ![]() |
6 mil | - |
Drills | ![]() |
thru-hole,blind, buried, microvia, castellated pleted holes and backdrill. | - |
Microvies | ![]() |
3 and 4 mils | - |
Resin filling vias/microvias | ![]() |
Taiyo THP-100DX non-conductive resin | - |
Copper filling microvias | ![]() |
Microvia filling with copper | - |
Scoring | ![]() |
Yes | - |
PCB surface finish | ![]() |
IAg, ENIG , HAL Lead Free, Hal Tin Lead, Hard Gold Edge Connectors and Graphite | Immersion Tin |
Photoimageable Solder Mask, legend and peelable ink | ![]() |
Yes | - |
Controlled Impedance
(previous analysis design) |
![]() |
10% | <10% |
UL listed | ![]() |
Yes FR4 | - |
Rigiflex | ![]() |
static and dynamic. | - |
IPCA600 | ![]() |
CLASS 2 | CLASS 3,3A * |
Last update: 06-06-2023
Units: Mils
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