Manufacturing capabilities

From its beginnings up to date, the constant modernization of the production systems, have placed Lab Circuits in an outstanding position in the European printed circuit boards manufacturing industry

With 20.000 m2 manufactured circuits a year, set aside for telecommunications, industry control, etc. Lab Circuits has acquired great experience in the manufacture of double sided printed circuit boards and multilayer printed circuit boards, being able to offer a high quality product with excellent delivery terms.

The manufacture of high complexity prototypes must be pointed out, as well as the efficiency in the manufacture of medium size series of the circuits we have referenced above.

The modern installations built in 1994, designed to achieve the best system for printed circuit boards manufacture, allows to products with high technology: pcb HDI, Rigiflex, RoHS, microvias-laser, buried routes, impedance certification and special materials pcb's

In Lab Circuits, research, production flow modernization and the training of our human team, are basic foundations to achieve the high entreaties of nowadays electronic industry and futures

MANUFACTURING CAPABILITIES

STANDARD SPECIALIZED
Materials spacer FR4,Alt Tg, High frequency ,PI -
No. Layers spacer from 2 to 32 -
PCB final thickness spacer de 0.8 a 3.2 mm. 0,5 and 4 mm.
Maximum PCB size spacer 570 mm x 500 mm 600x400 mm
Minimum Track / Space spacer 0.075/0.075 mm -
Base copper thickness spacer 17,35,70,105 µm -
Minimum Finished hole spacer 0.15 mm -
Drills spacer thru-hole, blind, buried, microvia, castellated plated holes and backdrill. -
Microvias spacer 75 µm amd 100 µm -
Resin filling vias/microvias spacer Taiyo THP-100DX non-conductive resin -
Copper filling microvias spacer Microvia filling with copper -
Scoring spacer Yes -
PCB surface finish spacer ImAg
ENIG
HAL Lead Free
HAL Tin Lead
Hard Gold Edge Connectors
Graphite
ENEPIG
EPIG
ImSn
Photoimageable Solder Mask, legend and peelable ink spacer Yes -
Controlled Impedance
(previous analysis design)
spacer 10% <10%
UL listed spacer Yes in FR4 -
Rigiflex spacer static and dynamic. -
IPCA600 spacer CLASS 2 CLASS 3,3A *

Last update: 07-06-2023
Units: Milimeters

Materials STANDARD SPECIALIZED
Materials spacer FR4,High Tg, High frequency,PI
-
Multilayer spacer from 2 to 30 layers -
PCB final thickness spacer de 32 a 126 mil 20 and 158 mils
Maximum PCB size spacer 22.4 x 19,7
23.5 x 15.5
min. Trace / Space spacer 3/3 mil -
Base copper thickness spacer ½,1,2,3 oz -
min. Finished hole size spacer 6 mil -
Drills spacer thru-hole,blind, buried, microvia, castellated pleted holes and backdrill. -
Microvies spacer 3 and 4 mils -
Resin filling vias/microvias spacer Taiyo THP-100DX non-conductive resin -
Copper filling microvias spacer Microvia filling with copper -
Scoring spacer Yes -
PCB surface finish spacer IAg, ENIG , HAL Lead Free, Hal Tin Lead, Hard Gold Edge Connectors and Graphite Immersion Tin
Photoimageable Solder Mask, legend and peelable ink spacer Yes -
Controlled Impedance
(previous analysis design)
spacer 10% <10%
UL listed spacer Yes FR4 -
Rigiflex spacer static and dynamic. -
IPCA600 spacer CLASS 2 CLASS 3,3A *

Last update: 06-06-2023
Units: Mils