Trace / spacing width
(thickness copper foil) |
|
±25% (35-70 µm)
±20% (17 µm ) |
±15% (35-70 µm)
±10% (17 µm) |
Plated hole diameter |
|
+0,10 mm / -0,05 mm
(or equivalent)
|
+0,10 mm / -0,0 mm
(or equivalent)
|
Non plated hole diameter |
|
+0,10 mm / -0,0 mm
(or equivalent)
|
±0,035 mm
(or equivalent)
|
Castellated plated holes |
|
Total thickness circuit.....................>= 0,5 mm
Cross annular ring.......... detall - A >= 0,5 mm
Minimum diameter..........detall - B >= 0,5 mm
Longitudinal annular...... detall - C >= 0,15 mm
Annular separation.........detall - D >= 0,15 mm
Edge separation..............detall - E >= 2 mm |
- |
Scoring to copper clearance |
|
Min. 1,0 mm. |
Min. 0,75 mm. |
Scoring positioning |
|
±0,10 mm |
±0,075 mm |
Scoring remaining thickness |
|
±0,15 mm
|
±0,075 mm
|
Board size |
|
± 0,15 mm.
|
± 0,10 mm. |
Total thickness tolerance |
|
±10 % |
±5 % |
Finished plated hole copper thickness |
|
Average: 25 µm
Minim: 20 µm |
Average: 35 µm
Mínim: 30 µm |
Mínimum wall between same net plated through holes |
|
0.30 mm |
0.25 mm |
Minimum wall between different net plated through holes |
|
0,40 mm. |
0,35 mm. |
Minimum wall between non plated through holes |
|
0,25 mm. |
0,20 mm. |
Minimum annular ring non plated hole |
|
0,25 mm
|
0,20 mm
|
Track to non plated through hole minimum spacing |
|
0,20 mm
|
0,15 mm
|
Track to board edge minimum spacing |
|
0,20 mm
|
0,15 mm
|
Offset between board edge and drill |
|
Max. 0,15 mm.
|
Max. 0,10 mm.
|
Drill to pad misalingnement |
|
Max. 0,10 mm.
|
Max. 0,075 mm.
|
Soldermask feature tolerance |
|
Max. 0,15 mm. |
Max. 0,075 mm. |
Soldermask min Dam size on fiber |
|
SOLDERMASK GREEN COLOR
Damm 70µm if final copper thickness is 17÷54µm.
Damm 85µm if final copper thickness is 55÷85µm.
Damm 105µm if final copper thickness is 86÷155µm.
SOLDERMASK WHITE COLOR
Damm 110µm if final copper thickness is 17÷54µm.
Damm 110µm if final copper thickness is 55÷85µm.
Other final copper thickness > 85µm, to consult.
OTHER SOLDERMASK COLORS
Damm 80µm if final copper thickness is 17÷54µm.
Damm 95µm if final copper thickness is 55÷85µm.
Damm 105µm if final copper thickness is 86÷155µm. |
-- |
Photoimageable soldermask clearance |
|
0,07 mm
|
0.06 mm |
Silkscreened soldermask clearance |
|
0,20 mm
|
0,15 mm
|
Legend minimum line |
|
0,125 mm
|
0,10 mm
|
Conductive ink (graphite) overlapping |
|
0,20 mm
|
0,125 mm
|
Conductive ink (graphite) spacing |
|
0,50 mm |
0,40 mm |
Conductive ink to pad spacing |
|
0,40 mm |
0,30 mm |
Peel-off mask overlapping |
|
0.8 mm
|
0,50 mm
|
Peel-off mask to pad spacing |
|
1 mm |
0,70 mm |
Peel-off mask to board
edge spacing |
|
1 mm |
0,70 mm |
Maximum peel-off mask filled hole |
|
1.8 mm |
2 mm |
Bow and twist |
|
Maxim 1% |
Maxim 0,5 % |
Insulation resistance |
|
Minim 0,5 MOhm |
Minim 2,0 MOhm |
Continuity |
|
Maxim 10 Ohms |
- |
Ionic contamination |
|
Max. 0,4 µg Eq. NaCl/cm² |
Max. 0,4 µg Eq. NaCl/cm² |
For other features |
|
See spec.
IPC-A-600 Rev K jul-20 |
- |