DOUBLE-SIDE

Double-side

Features manufacture double-side and General tolerances

We classify the circuit difficulty in accordance with the next parameters:

CLASS

Dimensional characteristics of the different elements that form the image of the printed circuit board.

RING CHECK

Copper ring between de hole and the pad. This parameter determinates the alignment difficulty between the hole and the printed circuit board image.

TOLERANCES

Tolerance level of the different proceedings and materials.

The sum of these three items will define the manufacture difficulty and therefore the price of the printed circuit board.

Milimeters
Mils

	CLASS 3	CLASS 4	CLASS 5	CLASS 6	CLASS 7
Minimum plated through hole diameter	0,50 mm	0,30 mm	0,30 mm	0,20 mm	0,15 mm
Minimum non plated through hole diameter	0,60 mm	0,40 mm	0,40 mm	0,30 mm	0,25 mm
Aspect / Ratio	5	5	6	8	13 (maximum thickness 2 mm)
Minimum trace / spacing width	0,30 mm (17 µ ) 0,30 mm (35 µ ) 0,35 mm ( 70 µ )	0,20 mm (17 µ ) 0,20 mm (35 µ ) 0,25 mm ( 70 µ )	0,150 mm (17 µ) 0,150 mm (35 µ) 0,200 mm (70 µ )	0,125 mm (17 µ) 0,150 mm (35 µ) 0,175 mm (70 µ )	0,100 mm (17 µ)
Minimum annular ring	0.22 mm	0.17 mm	0.13mm	0.10mm	0.075 mm

Last update: 19-06-2007
Units: Milimeters

	CLASS 3	CLASS 4	CLASS 5	CLASS 6	CLASS 7
Minimum plated through hole diameter	20 mil	12 mil	12 mil	8 mil	6 mil
Minimum non plated through hole diameter	24 mil	16 mil	16 mil	12 mil	10 mil
Aspect / Ratio	5	5	6	8	13 (maximum thickness 2 mm)
Minimum trace / spacing width	12 mil (½ oz ) 12 mil (1 oz ) 14 mil (2 oz )	8 mil (½ oz ) 8 mil (1 oz ) 10 mil (2 oz )	6 mil (½ oz ) 6 mil (1 oz ) 8 mil (2 oz )	5 mil (½ oz ) 6 mil (1 oz ) 7 mil (2 oz )	4 mil (½ oz )
Minimum annular ring	9 mil	7 mil	5 mil	4 mil	3 mils

Last update: 19-05-2007
Units: Mils

	STANDARD	SPECIAL
Trace / spacing width (thickness copper foil)	±25% (35-70 µm) ±20% (17 µm )	±15% (35-70 µm) ±10% (17 µm)
Plated hole diameter	+0,10 mm / -0,05 mm (or equivalent)	+0,10 mm / -0,0 mm (or equivalent)
Non plated hole diameter	+0,10 mm / -0,0 mm (or equivalent)	±0,035 mm (or equivalent)
Scoring to copper clearance	Min. 1,0 mm.	Min. 0,75 mm.
Scoring positioning	±0,10 mm	±0,075 mm
Scoring remaining thickness	±0,15 mm	±0,075 mm
Board size	± 0,15 mm.	± 0,10 mm.
Total thickness tolerance	±10 %	±5 %
Finished plated hole copper thickness	Average: 25 µm Minim: 20 µm	Average: 35 µm Mínim: 30 µm
Mínimum wall between same net plated through holes	0.30 mm	0.25 mm
Minimum wall between different net plated through holes	0,40 mm.	0,35 mm.
Minimum wall between non plated through holes	0,25 mm.	0,20 mm.
Minimum annular ring non plated hole	0,25 mm	0,20 mm
Track to non plated through hole minimum spacing	0,20 mm	0,15 mm
Track to board edge minimum spacing	0,20 mm	0,15 mm
Offset between board edge and drill	Max. 0,15 mm.	Max. 0,10 mm.
Drill to pad misalingnement	Max. 0,10 mm.	Max. 0,075 mm.
Soldermask feature tolerance	Max. 0,15 mm.	Max. 0,075 mm.
Soldermask min Dam size	0.08 mm green color other colors on request	--
Photoimageable soldermask clearance	0,07 mm	0.06 mm
Silkscreened soldermask clearance	0,20 mm	0,15 mm
Legend minimum line	0,125 mm	0,10 mm
Conductive ink (graphite) overlapping	0,20 mm	0,125 mm
Conductive ink (graphite) spacing	0,50 mm	0,40 mm
Conductive ink to pad spacing	0,40 mm	0,30 mm
Peel-off mask overlapping	0.8 mm	0,50 mm
Peel-off mask to pad spacing	1 mm	0,70 mm
Peel-off mask to board edge spacing	1 mm	0,70 mm
Maximum peel-off mask filled hole	1.8 mm	2 mm
Bow and twist	Maxim 1%	Maxim 0,5 %
Insulation resistance	Minim 0,5 MOhm	Minim 2,0 MOhm
Continuity	Maxim 10 Ohms	-
Ionic contamination	Max. 0,4 µg Eq. NaCl/cm²	Max. 0,4 µg Eq. NaCl/cm²
For other features	See spec. IPC-A-600 Rev.G jul-04	-

Last update: 17-10-2019
Units: Milimeters

	STANDARD	SPECIAL
Trace / spacing width	±20% (½ oz ) ±25% (1-2 oz )	±10% (½ oz ) ±15% (1 - 2 oz)
Plated hole diameter	+4 mil / -2 mil (or equivalent)	+4 mil / -0,0 mil ±2 mil
Non plated hole diameter	+4 mil / -0,0 mil (or equivalent)	±1.4 mil (or equivalent)
Scoring to copper clearance	Min. 40 mil.	Min. 30 mil
Scoring positioning	± 4 mil	± 3 mil
Scoring remaining thickness	± 4 mil	± 2 mil
Board size	± 6 mil.	± 4 mil.
Total thickness tolerance	±10 %	±5 %
Finished plated hole copper thickness	Average: 0.7 oz Minimum: 0.6 oz	Average: 1 oz Minimum: 0.86 oz
Minimum wall between same net plated through holes	12 mil.	10 mil.
Minimum wall between different net plated through holes	16 mil.	14 mil.
Minimum wall between non plated through holes	10 mil.	8 mil.
Minimum annular ring non plated hole	10 mil.	8 mil.
Track to non plated through hole minimum spacing	8 mil.	6 mil.
Conductor to board edge minimum spacing	8 mil.	6 mil.
Offset between board edge and drill	Max. 6 mil.	Max. 4 mil.
Offset between drill to outlayer pad	Max. 4 mil.	Max. 3 mil.
Soldermask feature tolerance	Max. 6 mil.	Max. 3 mil.
Soldermask minimum Dam size	3.15 mil. green color other colors on request	-
Photoimageable soldermask clearance	3 mil.	2.36 mil.
Silkscreened soldermask clearance	8 mil.	6 mil.
Legend minimum line	5 mil.	4 mil.
Conductive ink (graphite) overlapping	8 mil.	5 mil.
Conductive ink (graphite) spacing	20 mil.	16 mil.
Conductive ink to pad spacing	16 mil.	12 mil.
Peel-off mask overlapping	32 mil.	20 mil.
Peel-off mask to pad spacing	40 mil.	28 mil.
Peel-off mask to board edge spacing	40 mil.	28 mil.
Maximum peel-off mask filled hole	71 mil.	79 mil.
Bow and twist	Maxim 1%	Maxim 0,5 %
Insulation resistance	Minimum 0,5 MOhm	Minimum 2,0 MOhm
Continuity	Maxim 10 Ohms	-
Ionic contamination	Max. 1µg Eq. CINa/cm2	Max. 0,8 µg Eq. CINa/cm2
Other features	See spec. IPC-A-600 Rev.E 8-95	-

Last update: 01-12-2014
Units: Mils

Manufacturing capabilities

Multilayer

Double-side circuit boards

Rigiflex