TECHNICAL INFORMATION

Printed circuit boards manufacturing process

The enclosed video reproduces the manufacturing process of a six layer printed circuit board with one level microvias on both sides and buried vias from layer two to layer five.

The main phases in the manufacturing process are:

Photoimageable film application, photoexposure, optical test, multilayer pressing, drilling process, desmear, hole conditioning, electroplating, laser microvias, soldermask, legend, metal finish, electrical test.