• Tables
MANUFACTURING CAPABILITIES
Last update: 24-08-2010
Units: Milimeters |
|
|
|
STANDARD |
SPECIALIZED |
| Materials |
 |
FR4,Alt Tg, High frequency ,PI |
- |
| Multilayer |
|
from 2 to 24 layers |
- |
| PCB final thickness |
|
de 0.8 a 3.2 mm. |
0,5 and 4 mm. |
| Maximum PCB size |
|
570 mm x 500 mm |
600x400 mm |
| Minimum Track/Space |
|
0.075/0.075 mm |
- |
| Base copper thickness |
|
17,35,70,105 µm |
- |
| Minimum Finished hole |
|
0.15 mm |
- |
| Drills |
|
thru-hole, blind and buried. |
- |
| Microvias |
|
75 µm amd 100 µm |
- |
| Scoring |
|
Yes |
- |
| PCB surface finish |
|
IAg, ENIG , HAL Lead Free,
Hal Tin Lead, Hard Gold Edge Connectors
and Graphite |
Immersion Tin |
| Photoimageable Solder Mask, legend and peelable ink |
|
Yes |
- |
| Controlled Impedance |
|
10% |
<10% |
| UL listed |
|
Yes in FR4 |
- |
| Rigiflex |
|
static and dynamic. |
- |
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