• Tables

PARAMETERS MANUFACTURE MULTILAYER

		CLASS 3	CLASS 4	CLASS 5	CLASS 6	CLASS 7
Minimum plated through hole diameter		0,50 mm	0,30 mm	0,30 mm	0,20 mm	0,15 mm
Minimum non plated through hole diameter		0,60 mm	0,40 mm	0,40 mm	0,30 mm	0,25 mm
Aspect/Ratio		5	5	6	8	13 (maximun thickness 2 mm)
Minimum outerlayer trace/spacing width		0,30 mm (17 µ m) 0,30 mm (35 µ m) 0,35 mm (70 µ m)	0,20 mm (17 µ m) 0,20 mm (35 µ m) 0,25 mm (70 µ m)	0,15 mm (17 µ m) 0,15 mm (35 µ m) 0,20 mm (70 µ m)	0,125 mm (17 µm) 0,15 mm (35 µm) 0,175 mm (70 µm)	0,100 mm (17 µ)
Minimum innerlayer trace/spacing width		0,25 mm (17 µ m) 0,30 mm (35 µ m) 0,30 mm (70 µ m)	0,15 mm (17 µ m) 0,20 mm (35 µ m) 0,20 mm (70 µ m)	0,125 mm (17 µ m) 0,15 mm (35 µ m) 0,175 mm (70 µ m)	0,10 mm (17 µ m) 0,125 mm (35 µ m) 0,15 mm (70 µ m)	0,075 mm (17 µ m) 0,100 mm (35 µ m)
Minimum Outer layer annular ring		0.22 mm	0.17 mm	0.13 mm	0.10 mm	0.075 mm
Minimum Signal inner layer annular ring		0.25 mm	0.22 mm	0.19 mm	0.15 mm	0.125 mm
Minimum annular spacing in ground plane		0.40 mm	0.40 mm	0.30 mm	0.25 mm	0.20 mm
Minimum microvia diameter				0,10 mm (max. thickness 0.1 mm)	0,075 mm (max. thickness 0.065 mm)	0,075 mm (max. thickness 0.065 mm)
Microvia surface pad				0.35 mm	0.30 mm	0.25 mm
Microvia landing pad				0.30 mm	0.25 mm	0.20 mm
Minimum wall between microvia and thru hole / blind/ buried				0.22 mm	0.15 mm	0.10 mm
Minimum wall between microvias				0.23 mm	0.15 mm	0.10 mm
Minimum wall between microvias in two levels				0.23 mm	0.15 mm	0.10 mm