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Rigiflex

RIGIFLEX DESIGN RULES

According IPC-6013

Last update: 10-03-2017
Units: Milimeters



Description Use A Static (FR4) Use B dynamic (PolyImide)
minimum plated through hole B Minimum plated through hole B 0.15 mm 0.15 mm
minimum pad diameter A Min. pad diameter A minimum pad diameter B + 150΅m minimum pad diameter B + 260΅m
minimum length from plated through hole to flex minimum length from plated through hole to flex 0.8 mm 0.8 mm
Copper distance to Rigiflex intersection Copper distance to Rigiflex intersection ≥ 350 ΅m ≥ 400 ΅m
Copper distance to Rigiflex intersection Copper distance to Rigiflex intersection ≥ 200 ΅m ≥ 250 ΅m
minimum length of flex area minimum length of flex area ≥ 2.0 mm ≥ 2.0 mm
Distance track-flex outline Distance track-flex outline ≥ 350 ΅m ≥ 350 ΅m
minimum bending radius minimum bending radius 5 mm 3.2 mm
Minimum Signal inner layer annular ring Ring Check 0.125 mm 0.19 mm
Minimum distance form Rigid to Flex Minimum distance form Rigid to Flex 1.0 mm 1.0 mm
max. quantity of bending cycles with min. bending radius spacer 10 with radius 5.0 mm 6000 s/IPC-TM-650 2.4.3
Thickness of flex material spacer 75, 100 ΅m 50 ΅m standard (25,75,100,125,150 on demand)
Cu thickness of flex layers spacer 17, 35 ΅m 17, 35, 70 ΅m
Thickness of coverlayer IPC-4203/1 spacer 25 ΅m 25 ΅m
Max. number of flex layers spacer 2 8
General tolerances spacer Class 7 Lab Circuits Class 7, Annular Ring class 5
Maximum PCB size spacer 530 x 400 mm 530 x 400 mm

 

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