RIGIFLEX

Rigiflex

According IPC-6013

image	Semiflex(FR4)/Soldermask Flex	Flex (PolyImide)
minimum plated through hole B	0.15 mm	0.15 mm
minimum pad diameter A	minimum pad diameter B + 150µm	minimum pad diameter B + 260µm
minimum length from plated through hole to flex	0.8 mm	0.8 mm
Copper distance to Rigiflex intersection	350 µm	700 µm
Copper distance to Rigiflex intersection	≥ 200 µm	>= 250 µm
minimum length of flex area	≥ 2.0 mm	≥ 2.0 mm
Distance track-flex outline	≥ 350 µm	≥ 350 µm
minimum bending radius	5 mm	3.2 mm
Minimum Signal inner layer annular ring	0.125 mm	0.19 mm
Minimum distance form Rigid to Flex	1.0 mm	1.0 mm
Minimum distance from ZIF connector to Flex	> 2 mm	> 2 mm
Track to plated through hole minimum spacing	>= 250 µm	>= 300 µm
Crosshatched ground plane	-	strongly recommended to prevent moisture entrapment and increase flexibility
max. quantity of bending cycles with min. bending radius	10 with radius 5.0 mm	6000 s/IPC-TM-650 2.4.3
Thickness of flex material	75, 100 µm	50 µm standard (25,75,100,125,150 on demand)
Cu thickness of flex layers	17, 35 µm	17, 35, 70 µm
Thickness of coverlayer IPC-4203/1	25 µm	25 µm
Max. number of flex layers	2	8
General tolerances	Class 7 Lab Circuits	Class 7, Annular Ring class 5
Maximum PCB size	530 x 400 mm	530 x 400 mm

Last update: 03-06-2026
Units: Milimeters