Rigiflex

Features manufacture rigiflex

According IPC-6013

image Use A Static (FR4) Use B dynamic (PolyImide)
minimum plated through hole B 0.15 mm 0.15 mm
minimum pad diameter A minimum pad diameter B + 150µm minimum pad diameter B + 260µm
minimum length from plated through hole to flex 0.8 mm 0.8 mm
Copper distance to Rigiflex intersection ≥ 350 µm ≥ 400 µm
Copper distance to Rigiflex intersection ≥ 200 µm ≥ 250 µm
minimum length of flex area ≥ 2.0 mm ≥ 2.0 mm
Distance track-flex outline ≥ 350 µm ≥ 350 µm
minimum bending radius 5 mm 3.2 mm
Minimum Signal inner layer annular ring 0.125 mm 0.19 mm
Minimum distance form Rigid to Flex 1.0 mm 1.0 mm
max. quantity of bending cycles with min. bending radius spacer 10 with radius 5.0 mm 6000 s/IPC-TM-650 2.4.3
Thickness of flex material spacer 75, 100 µm 50 µm standard (25,75,100,125,150 on demand)
Cu thickness of flex layers spacer 17, 35 µm 17, 35, 70 µm
Thickness of coverlayer IPC-4203/1 spacer 25 µm 25 µm
Max. number of flex layers spacer 2 8
General tolerances spacer Class 7 Lab Circuits Class 7, Annular Ring class 5
Maximum PCB size spacer 530 x 400 mm 530 x 400 mm

Last update: 10-03-2017
Units: Milimeters