General tolerances
MULTILAYER GENERAL TOLERANCES
|
|
STANDARD |
SPECIAL |
| Outer layer trace/spacing width |
|
±25% (35-70 µm)
±20% (17 µm ) |
±15% (35-70 µm)
±10% (17 µm) |
| Inner layer trace/spacing width |
|
±25% (70 µm )
±20% (17-35 µm ) |
±15% (35-70 µm)
±10% (17 µm) |
| Plated hole diameter |
|
+0,10 mm / -0,05 mm
(or equivalent)
|
+0,10 mm / -0,0 mm
(or equivalent)
|
| Non plated hole diameter |
|
+0,10 mm / -0,0 mm
(or equivalent)
|
±0,035 mm
(or equivalent)
|
| Scoring to copper clearance |
|
Min. 1,0 mm. |
Min. 0,75 mm. |
| Scoring positioning |
|
±0,10 mm |
±0,075 mm |
| Scoring remaining thickness |
|
±0,15 mm
|
±0,075 mm
|
| Board size |
|
± 0,15 mm.
|
± 0,10 mm. |
| Total thickness tolerance |
|
±10 % |
±5 % |
| Dielectric thickness |
|
±10 % |
±5 % |
| Finished plated hole copper thickness |
|
Average: 25 µm
Minim: 20 µm |
Average: 35 µm
Mínim: 30 µm |
| Blind/buried plated hole copper thickness |
|
Average: 15 µm
Minim: 13 µm |
Mitja: 25 µm
Mínim: 20 µm |
| Microvia Plated hole copper thickness |
|
Mitja: 15 µm
Mínim:13 µm |
Mitja: 25 µm
Mínim: 20 µm |
| Mínimum wall between same net plated through holes |
|
0.30 mm |
0.25 mm |
| Minimum wall between different net plated through holes |
|
0,40 mm. |
0,35 mm. |
| Minimum wall between non plated thruough holes |
|
0,25 mm. |
0,20 mm. |
| Minimum annular ring non plated hole |
|
0,25 mm
|
0,20 mm
|
| Track to non plated through hole minimum spacing |
|
0,20 mm
|
0,15 mm
|
| Track to board edge minimum spacing |
|
0,20 mm
|
0,15 mm
|
| Offset between board edge and drill |
|
Max. 0,15 mm.
|
Max. 0,10 mm.
|
| Offset between drill to outlayer pad |
|
Max. 0,10 mm.
|
Max. 0,075 mm.
|
| Offset between drill to innerlayer pad |
|
Max. 0,15 mm. |
Max. 0,12 mm.
|
| Offset between layers |
|
Max. 0,10 mm.
|
Max. 0,075 mm.
|
| Soldermask feature tolerance |
|
Max. 0,15 mm. |
Max. 0,075 mm. |
| Soldermask min Dam size |
|
0.075 mm
0.10 mm white ink |
|
| Photoimageable soldermask clearance |
|
0.075 mm |
|
| Silkscreened soldermask clearance |
|
0,20 mm
|
0,15 mm
|
| Legend minimum line |
|
0,125 mm
|
0,10 mm
|
| Conductive ink (graphite) overlapping |
|
0,20 mm
|
0,125 mm
|
| Conductive ink (graphite) spacing |
|
0,50 mm |
0,40 mm |
| Conductive ink to pad spacing |
|
0,40 mm |
0,30 mm |
| Peel-off mask overlapping |
|
1 mm
|
0,70 mm
|
| Peel-off mask to pad spacing |
|
1 mm |
0,70 mm |
Peel-off mask to board
edge spacing |
|
1 mm |
0,70 mm |
| Maximum peel-off mask filled hole |
|
1.80 mm |
2 mm |
| Bow and twist |
 |
Maxim 1% |
Maxim 0,5 % |
| Insulation resistance |
|
Minim 0,5 MOhm |
Minim 2,0 MOhm |
| Continuity |
|
Maxim 10 Ohms |
- |
| Ionic contamination |
|
Max. 1µg Eq. CINa/cm2 |
Max. 0,8 µg Eq. CINa/cm2 |
| Other features |
|
See spec.
IPC-A-600 Rev.G jul-04 |
- |
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