• Double side circuit boards

- FEATURES MANUFACTURE DOUBLE SIDE
- GENERAL TOLERANCES

In order to classify the printed circuits’ difficulty we use the following parameters:

- CLASS
Is the dimensional characteristics set of the different elements that compose the printed circuit board image.

- RING CHECK
Makes reference to the copper ring between the hole and its pad. This parameter will determine the difficulty of trim between the hole and the image of the circuit.

- TOLERANCES
Made reference to the tolerance level of the different processes and materials.

The total of these 3 concepts will define the manufacture difficulty and therefore the price of the circuit.

PARAMETERS MANUFACTURE DOUBLE SIDE

		CLASS 3	CLASS 4	CLASS 5	CLASS 6	CLASS 7
Minimum plated through hole diameter		0,50 mm	0,30 mm	0,30 mm	0,20 mm	0,15 mm
Minimum non plated through hole diameter		0,60 mm	0,40 mm	0,40 mm	0,30 mm	0,25 mm
Aspect/Ratio		5	5	6	8	13 (maximum thickness 2 mm)
Minimum trace/spacing width		0,30 mm (17 µ ) 0,30 mm (35 µ ) 0,35 mm ( 70 µ )	0,20 mm (17 µ ) 0,20 mm (35 µ ) 0,25 mm ( 70 µ )	0,150 mm (17 µ) 0,150 mm (35 µ) 0,200 mm (70 µ )	0,125 mm (17 µ) 0,150 mm (35 µ) 0,175 mm (70 µ )	0,100 mm (17 µ)
Minimum annular ring		0.22 mm	0.17 mm	0.13mm	0.10mm	0.075 mm

MULTILAYER GENERAL TOLERANCES

		STANDARD	SPECIAL
Outer layer trace/spacing width		±25% (35-70 µm) ±20% (17 µm )	±15% (35-70 µm) ±10% (17 µm)
Inner layer trace/spacing width		±25% (70 µm ) ±20% (17-35 µm )	±15% (35-70 µm) ±10% (17 µm)
Plated hole diameter		+0,10 mm / -0,05 mm (or equivalent)	+0,10 mm / -0,0 mm (or equivalent)
Non plated hole diameter		+0,10 mm / -0,0 mm (or equivalent)	±0,035 mm (or equivalent)
Scoring to copper clearance		Min. 1,0 mm.	Min. 0,75 mm.
Scoring positioning		±0,10 mm	±0,075 mm
Scoring remaining thickness		±0,15 mm	±0,075 mm
Board size		± 0,15 mm.	± 0,10 mm.
Total thickness tolerance		±10 %	±5 %
Dielectric thickness		±10 %	±5 %
Finished plated hole copper thickness		Average: 25 µm Minim: 20 µm	Average: 35 µm Mínim: 30 µm
Blind/buried plated hole copper thickness		Average: 15 µm Minim: 13 µm	Mitja: 25 µm Mínim: 20 µm
Microvia Plated hole copper thickness		Mitja: 15 µm Mínim:13 µm	Mitja: 25 µm Mínim: 20 µm
Mínimum wall between same net plated through holes		0.30 mm	0.25 mm
Minimum wall between different net plated through holes		0,40 mm.	0,35 mm.
Minimum wall between non plated thruough holes		0,25 mm.	0,20 mm.
Minimum annular ring non plated hole		0,25 mm	0,20 mm
Track to non plated through hole minimum spacing		0,20 mm	0,15 mm
Track to board edge minimum spacing		0,20 mm	0,15 mm
Offset between board edge and drill		Max. 0,15 mm.	Max. 0,10 mm.
Offset between drill to outlayer pad		Max. 0,10 mm.	Max. 0,075 mm.
Offset between drill to innerlayer pad		Max. 0,15 mm.	Max. 0,12 mm.
Offset between layers		Max. 0,10 mm.	Max. 0,075 mm.
Soldermask feature tolerance		Max. 0,15 mm.	Max. 0,075 mm.
Soldermask min Dam size		0.075 mm
Photoimageable soldermask clearance		0.075 mm
Silkscreened soldermask clearance		0,20 mm	0,15 mm
Legend minimum line		0,125 mm	0,10 mm
Conductive ink (graphite) overlapping		0,20 mm	0,125 mm
Conductive ink (graphite) spacing		0,50 mm	0,40 mm
Conductive ink to pad spacing		0,40 mm	0,30 mm
Peel-off mask overlapping		1 mm	0,70 mm
Peel-off mask to pad spacing		1 mm	0,70 mm
Peel-off mask to board edge spacing		1 mm	0,70 mm
Maximum peel-off mask filled hole		1.80 mm	2 mm
Bow and twist		Maxim 1%	Maxim 0,5 %
Insulation resistance		Minim 0,5 MOhm	Minim 2,0 MOhm
Continuity		Maxim 10 Ohms	-
Electrical strength		750 V/mil (30 V/µm.) segons MIL-13949 H	-
Ionic contamination		Max. 1µg Eq. CINa/cm2	Max. 0,8 µg Eq. CINa/cm2
Other features		See spec. IPC-A-600 Rev.G jul-04	-