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• Double side circuit boards

- FEATURES MANUFACTURE DOUBLE SIDE
- GENERAL TOLERANCES

In order to classify the printed circuits’ difficulty we use the following parameters:

- CLASS
Is the dimensional characteristics set of the different elements that compose the printed circuit board image.

- RING CHECK
Makes reference to the copper ring between the hole and its pad. This parameter will determine the difficulty of trim between the hole and the image of the circuit.

- TOLERANCES
Made reference to the tolerance level of the different processes and materials.

The total of these 3 concepts will define the manufacture difficulty and therefore the price of the circuit.


PARAMETERS MANUFACTURE DOUBLE SIDE


Last update: 19-06-2007
Units: Milimeters
[Display using MILS]

CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter View schema... 0,50 mm 0,30 mm 0,30 mm 0,20 mm 0,15 mm
Minimum non plated through hole diameter View schema... 0,60 mm 0,40 mm 0,40 mm 0,30 mm 0,25 mm
Aspect/Ratio View schema... 5 5 6 8 13
(maximum thickness 2 mm)
Minimum trace/spacing width View schema... 0,30 mm (17 µ )
0,30 mm (35 µ )
0,35 mm ( 70 µ )
0,20 mm (17 µ )
0,20 mm (35 µ )
0,25 mm ( 70 µ )
0,150 mm (17 µ)
0,150 mm (35 µ)
0,200 mm (70 µ )
0,125 mm (17 µ)
0,150 mm (35 µ)
0,175 mm (70 µ )
0,100 mm (17 µ)
Minimum annular ring
View schema... 0.22 mm 0.17 mm 0.13mm 0.10mm 0.075 mm

 

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MULTILAYER GENERAL TOLERANCES


Last update: 28-04-2010
Units: Milimeters
[Display using MILS]

STANDARD SPECIAL
Outer layer trace/spacing width View schema... ±25% (35-70 µm)
±20% (17 µm )
±15% (35-70 µm)
±10% (17 µm)
Inner layer trace/spacing width View schema... ±25% (70 µm )
±20% (17-35 µm )
±15% (35-70 µm)
±10% (17 µm)
Plated hole diameter View schema... +0,10 mm / -0,05 mm
(or equivalent)
+0,10 mm / -0,0 mm
(or equivalent)
Non plated hole diameter View schema... +0,10 mm / -0,0 mm
(or equivalent)
±0,035 mm
(or equivalent)
Scoring to copper clearance View schema... Min. 1,0 mm. Min. 0,75 mm.
Scoring positioning View schema... ±0,10 mm ±0,075 mm
Scoring remaining thickness View schema... ±0,15 mm
±0,075 mm
Board size View schema... ± 0,15 mm.
± 0,10 mm.
Total thickness tolerance View schema... ±10 % ±5 %
Dielectric thickness View schema... ±10 % ±5 %
Finished plated hole copper thickness View schema... Average: 25 µm
Minim: 20 µm
Average: 35 µm
Mínim: 30 µm
Blind/buried plated hole copper thickness View schema... Average: 15 µm
Minim: 13 µm
Mitja: 25 µm
Mínim: 20 µm
Microvia Plated hole copper thickness View schema... Mitja: 15 µm
Mínim:13 µm
Mitja: 25 µm
Mínim: 20 µm
Mínimum wall between same net plated through holes View schema... 0.30 mm 0.25 mm
Minimum wall between different net plated through holes View schema... 0,40 mm. 0,35 mm.
Minimum wall between non plated thruough holes View schema... 0,25 mm. 0,20 mm.
Minimum annular ring non plated hole View schema... 0,25 mm
0,20 mm
Track to non plated through hole minimum spacing View schema... 0,20 mm
0,15 mm
Track to board edge minimum spacing View schema... 0,20 mm
0,15 mm
Offset between board edge and drill View schema... Max. 0,15 mm.
Max. 0,10 mm.
Offset between drill to outlayer pad View schema... Max. 0,10 mm.
Max. 0,075 mm.
Offset between drill to innerlayer pad View schema... Max. 0,15 mm. Max. 0,12 mm.
Offset between layers View schema... Max. 0,10 mm.
Max. 0,075 mm.
Soldermask feature tolerance View schema... Max. 0,15 mm. Max. 0,075 mm.
Soldermask min Dam size View schema... 0.075 mm
Photoimageable soldermask clearance View schema... 0.075 mm
Silkscreened soldermask clearance View schema... 0,20 mm
0,15 mm
Legend minimum line View schema... 0,125 mm
0,10 mm
Conductive ink (graphite) overlapping View schema... 0,20 mm
0,125 mm
Conductive ink (graphite) spacing View schema... 0,50 mm 0,40 mm
Conductive ink to pad spacing View schema... 0,40 mm 0,30 mm
Peel-off mask overlapping View schema... 1 mm
0,70 mm
Peel-off mask to pad spacing View schema... 1 mm 0,70 mm
Peel-off mask to board
edge spacing
View schema... 1 mm 0,70 mm
Maximum peel-off mask filled hole View schema... 1.80 mm 2 mm
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minim 0,5 MOhm Minim 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Electrical strength spacer 750 V/mil (30 V/µm.)
segons MIL-13949 H
-
Ionic contamination spacer Max. 1µg Eq. CINa/cm2 Max. 0,8 µg Eq. CINa/cm2
Other features spacer See spec.
IPC-A-600 Rev.G jul-04
-

 

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