• Capabilities
Since their beginning until today, the ongoing modernisation of the manufacturing systems has placed the Company at the forefront of the manufacture of circuit boards for the professional electronics industry.
Lab Circuits with a yearly output of 35,000 sq. m. of printed circuit boards for telecommunications, industrial control, computers, etc., have acquired a large expertise in the manufacture of two layer and multiple layer boards and can offer a high quality product with excellent delivery terms.
The manufacture of high complexity prototypes in medium runs, the real speciality of the Company, should be highlighted. The state of the art facilities, built in 1994, have been designed to optimise the production of circuit boards. Back-panels with press-fit technology, buried vias, blind vias, fine line and fine pitch circuits, SMD, etc.
The research, the updating of the system, and the constant formation of Lab Circuits human team make possible the achievement of the new requirements of the electronics industry.
MANUFACTURING CAPABILITIES
Last update: 11-06-2009
Units: Milimeters |
|
|
|
STANDARD |
SPECIALIZED |
| Materials |
 |
FR4 |
High Tg, BT/Epox, High frequency
|
| Multilayer |
|
from 2 to 10 layers |
up to 18 layers
|
| PCB final thickness |
|
de 0.8 a 3.2 mm. |
All thickness from 0.8 to 4.0 mm. |
| Maximum PCB size |
|
570 mm x 500 mm |
600x400 mm |
| min. Trace/Space |
|
0.150/0.150 mm |
0.075/0.075 mm |
| Base copper thickness |
|
17 i 35 µm |
70 and 105 µm |
| min. Finished hole size |
|
0.3 mm |
0.15 mm |
| Drills |
|
thru-hole |
Blind and buried
|
| Microvias |
|
100 µm |
75 µm |
| Scoring |
|
Yes |
YES |
| PCB surface finish |
|
IAg, ENIG , HAL Lead Free, Hal Tin Lead, Hard Gold Edge Connectors and Graphite |
Immersion Tin |
| Photoimageable Solder Mask, legend and peelable ink |
|
Yes |
Yes |
| Controlled Impedance |
|
Yes |
Yes |
| UL listed |
|
Yes |
Yes |
|
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