RIGIFLEX DESIGN RULES
According IPC-6013
Description Use A Static (FR4) Use B dynamic (PolyImide)
minimum plated through hole B Ver esquema... 0.15 mm 0.15 mm
minimum pad diameter A Ver esquema... minimum pad diameter B + 150µm minimum pad diameter B + 260µm
minimum length from plated through hole to flex Ver esquema... 0.8 mm 0.8 mm
Copper distance to Rigiflex intersection Ver esquema... ≥ 350 µm ≥ 400 µm
Copper distance to Rigiflex intersection Ver esquema... ≥ 200 µm ≥ 250 µm
minimum length of flex area Ver esquema... ≥ 2.0 mm ≥ 2.0 mm
Distance track-flex outline Ver esquema... ≥ 350 µm ≥ 350 µm
minimum bending radius Ver esquema... 5 mm 3.2 mm
Minimum Signal inner layer annular ring Ver esquema... 0.125 mm 0.19 mm
Minimum distance form Rigid to Flex Ver esquema... 1.0 mm 1.0 mm
max. quantity of bending cycles with min. bending radius spacer 10 with radius 5.0 mm 6000 s/IPC-TM-650 2.4.3
Thickness of flex material spacer 75, 100 µm 50 µm standard (25,75,100,125,150 on demand)
Cu thickness of flex layers spacer 17, 35 µm 17, 35, 70 µm
Thickness of coverlayer IPC-4203/1 spacer 25 µm 25 µm
Max. number of flex layers spacer 2 8
General tolerances spacer Class 7 Lab Circuits Class 7, Annular Ring class 5
Maximum PCB size spacer 530 x 400 mm 530 x 400 mm


Last update: 10-03-2017
Units: Milimeters