BILAYER GENERAL TOLERANCES
STANDARD SPECIAL
Trace / spacing width
(thickness copper foil)
Ver esquema... ±25% (35-70 µm)
±20% (17 µm )
±15% (35-70 µm)
±10% (17 µm)
Plated hole diameter Ver esquema... +0,10 mm / -0,05 mm
(or equivalent)
+0,10 mm / -0,0 mm
(or equivalent)
Non plated hole diameter Ver esquema... +0,10 mm / -0,0 mm
(or equivalent)
±0,035 mm
(or equivalent)
Scoring to copper clearance Ver esquema... Min. 1,0 mm. Min. 0,75 mm.
Scoring positioning Ver esquema... ±0,10 mm ±0,075 mm
Scoring remaining thickness Ver esquema... ±0,15 mm
±0,075 mm
Board size Ver esquema... ± 0,15 mm.
± 0,10 mm.
Total thickness tolerance Ver esquema... ±10 % ±5 %
Finished plated hole copper thickness Ver esquema... Average: 25 µm
Minim: 20 µm
Average: 35 µm
Mínim: 30 µm
Mínimum wall between same net plated through holes Ver esquema... 0.30 mm 0.25 mm
Minimum wall between different net plated through holes Ver esquema... 0,40 mm. 0,35 mm.
Minimum wall between non plated through holes Ver esquema... 0,25 mm. 0,20 mm.
Minimum annular ring non plated hole Ver esquema... 0,25 mm
0,20 mm
Track to non plated through hole minimum spacing Ver esquema... 0,20 mm
0,15 mm
Track to board edge minimum spacing Ver esquema... 0,20 mm
0,15 mm
Offset between board edge and drill Ver esquema... Max. 0,15 mm.
Max. 0,10 mm.
Drill to pad misalingnement Ver esquema... Max. 0,10 mm.
Max. 0,075 mm.
Soldermask feature tolerance Ver esquema... Max. 0,15 mm. Max. 0,075 mm.
Soldermask min Dam size Ver esquema... 0.08 mm green color
other colors on request
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Photoimageable soldermask clearance Ver esquema... 0,07 mm
0.06 mm
Silkscreened soldermask clearance Ver esquema... 0,20 mm
0,15 mm
Legend minimum line Ver esquema... 0,125 mm
0,10 mm
Conductive ink (graphite) overlapping Ver esquema... 0,20 mm
0,125 mm
Conductive ink (graphite) spacing Ver esquema... 0,50 mm 0,40 mm
Conductive ink to pad spacing Ver esquema... 0,40 mm 0,30 mm
Peel-off mask overlapping Ver esquema... 0.8 mm
0,50 mm
Peel-off mask to pad spacing Ver esquema... 1 mm 0,70 mm
Peel-off mask to board
edge spacing
Ver esquema... 1 mm 0,70 mm
Maximum peel-off mask filled hole Ver esquema... 1.8 mm 2 mm
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minim 0,5 MOhm Minim 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Ionic contamination spacer Max. 1µg Eq. CINa/cm2 Max. 0,8 µg Eq. CINa/cm2
For other features spacer See spec.
IPC-A-600 Rev.G jul-04
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Last update: 01-12-2014
Units: Milimeters