MULTILAYER GENERAL TOLERANCES
STANDARD SPECIAL
Outer layer trace / spacing width Ver esquema... ±20% (½ oz )
±25% (1-2 oz )
±10% (½ oz )
±15% (1 - 2 oz)
Inner layer trace / spacing width Ver esquema... ±20% (½ - 1 oz)
±25% (2 oz)
±10% (½ oz )
±15% (1 - 2 oz )
Plated hole diameter Ver esquema... +4 mil / -2 mil
(or equivalent)
+4 mil / -0,0 mil
±2 mil
Non plated hole diameter Ver esquema... +4 mil / -0,0 mil
(or equivalent)
±1.4 mil
(or equivalent)
Scoring to copper clearance Ver esquema... Min. 40 mil. Min. 30 mil
Scoring positioning Ver esquema... ± 4 mil ± 3 mil
Scoring remaining thickness Ver esquema... ± 4 mil
± 2 mil
Board size Ver esquema... ± 6 mil.
± 4 mil.
Total thickness tolerance Ver esquema... ±10 % ±5 %
Dielectric thickness Ver esquema... ±10 % ±5 %
Finished plated hole copper thickness Ver esquema... Average: 0.7 oz
Minimum: 0.6 oz
Average: 1 oz
Minimum: 0.86 oz
Blind/buried plated hole copper thickness Ver esquema... Average: 0.4 oz.
Minimum: 0.37 oz.
Average : 0.7 oz.
Minimum: 0.6 oz.
Microvia Plated hole copper thickness Ver esquema... Average: 0.4 oz.
Minimum:0.37 oz.

Average: 0.7 oz.
Minimum: 0.6 oz.

Mínimum wall between same net plated through holes Ver esquema... 12 mil. 10 mil.
Minimum wall between different net plated through holes Ver esquema... 16 mil. 14 mil.
Minimum wall between non plated thruough holes Ver esquema... 10 mil. 8 mil.
Minimum annular ring non plated hole Ver esquema... 10 mil.
8 mil.
Track to non plated through hole minimum spacing Ver esquema... 8 mil. 6 mil.
Track to board edge minimum spacing Ver esquema... 8 mil. 6 mil.
Offset between board edge and drill Ver esquema... Max. 6 mil.
Max. 4 mil.
Offset between drill to outlayer pad Ver esquema... Max. 4 mil.
Max. 3 mil.
Offset between drill to innerlayer pad Ver esquema... Max. 6 mil. Max. 5 mil.
Offset between layers Ver esquema... Max. 4 mil.
Max. 3 mil.
Soldermask feature tolerance Ver esquema... Max. 6 mil. Max. 3 mil.
Soldermask min Dam size Ver esquema... 3.15 mil. green color
other colors on request
--
Photoimageable soldermask clearance Ver esquema... 2.5 mil. --
Silkscreened soldermask clearance Ver esquema... 8 mil. 6 mil.
Legend minimum line Ver esquema... 5 mil. 4 mil.
Conductive ink (graphite) overlapping Ver esquema... 8 mil.
5 mil.
Conductive ink (graphite) spacing Ver esquema... 20 mil. 16 mil.
Conductive ink to pad spacing Ver esquema... 16 mil. 12 mil.
Peel-off mask overlapping Ver esquema... 32 mil. 20 mil.
Peel-off mask to pad spacing Ver esquema... 40 mil. 28 mil.
Peel-off mask to board
edge spacing
Ver esquema... 40 mil. 28 mil.
Maximum peel-off mask filled hole Ver esquema... 71 mil. 79 mil.
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minimum 0,5 MOhm Minimum 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Ionic contamination spacer Max. 1µg Eq. CINa/cm2 Max. 0,8 µg Eq. CINa/cm2
Other features spacer See spec.
IPC-A-600 Rev.E 8-95
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Last update: 20-09-2016
Units: Mils