RIGIFLEX DESIGN RULES
According IPC-6013
Description Use A Static (FR4) Use B dynamic (PolyImide)
minimum plated through hole B See diagram... 0.15 mm 0.15 mm
minimum pad diameter A See diagram... minimum pad diameter B + 150Ám minimum pad diameter B + 260Ám
minimum length from plated through hole to flex See diagram... 0.8 mm 0.8 mm
Copper distance to Rigiflex intersection See diagram... ≥ 350 Ám ≥ 400 Ám
Copper distance to Rigiflex intersection See diagram... ≥ 200 Ám ≥ 250 Ám
minimum length of flex area See diagram... ≥ 2.0 mm ≥ 2.0 mm
Distance track-flex outline See diagram... ≥ 350 Ám ≥ 350 Ám
minimum bending radius See diagram... 5 mm 3.2 mm
Minimum Signal inner layer annular ring See diagram... 0.125 mm 0.19 mm
Minimum distance form Rigid to Flex See diagram... 1.0 mm 1.0 mm
max. quantity of bending cycles with min. bending radius spacer 10 with radius 5.0 mm 6000 s/IPC-TM-650 2.4.3
Thickness of flex material spacer 75, 100 Ám 50 Ám standard (25,75,100,125,150 on demand)
Cu thickness of flex layers spacer 17, 35 Ám 17, 35, 70 Ám
Thickness of coverlayer IPC-4203/1 spacer 25 Ám 25 Ám
Max. number of flex layers spacer 2 8
General tolerances spacer Class 7 Lab Circuits Class 7, Annular Ring class 5
Maximum PCB size spacer 530 x 400 mm 530 x 400 mm


Last update: 10-03-2017
Units: Milimeters