BILAYER GENERAL TOLERANCES
STANDARD SPECIAL
Trace / spacing width See diagram... 20% ( oz )
25% (1-2 oz )
10% ( oz )
15% (1 - 2 oz)
Plated hole diameter See diagram... +4 mil / -2 mil
(or equivalent)
+4 mil / -0,0 mil
2 mil
Non plated hole diameter See diagram... +4 mil / -0,0 mil
(or equivalent)
1.4 mil
(or equivalent)
Scoring to copper clearance See diagram... Min. 40 mil. Min. 30 mil
Scoring positioning See diagram... 4 mil 3 mil
Scoring remaining thickness See diagram... 4 mil
2 mil
Board size See diagram... 6 mil.
4 mil.
Total thickness tolerance See diagram... 10 % 5 %
Finished plated hole copper thickness See diagram... Average: 0.7 oz
Minimum: 0.6 oz
Average: 1 oz
Minimum: 0.86 oz
Minimum wall between same net plated through holes See diagram... 12 mil. 10 mil.
Minimum wall between different net plated through holes See diagram... 16 mil. 14 mil.
Minimum wall between non plated through holes See diagram... 10 mil. 8 mil.
Minimum annular ring non plated hole See diagram... 10 mil.
8 mil.
Track to non plated through hole minimum spacing See diagram... 8 mil. 6 mil.
Conductor to board edge
minimum spacing
See diagram... 8 mil. 6 mil.
Offset between board edge and drill See diagram... Max. 6 mil.
Max. 4 mil.
Offset between drill to outlayer pad See diagram... Max. 4 mil.
Max. 3 mil.
Soldermask feature tolerance See diagram... Max. 6 mil. Max. 3 mil.
Soldermask minimum Dam size See diagram... 3.15 mil. green color
other colors on request
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Photoimageable soldermask clearance See diagram... 3 mil. 2.36 mil.
Silkscreened soldermask clearance See diagram... 8 mil. 6 mil.
Legend minimum line See diagram... 5 mil. 4 mil.
Conductive ink (graphite) overlapping See diagram... 8 mil.
5 mil.
Conductive ink (graphite) spacing See diagram... 20 mil. 16 mil.
Conductive ink to pad spacing See diagram... 16 mil. 12 mil.
Peel-off mask overlapping See diagram... 32 mil. 20 mil.
Peel-off mask to pad spacing See diagram... 40 mil. 28 mil.
Peel-off mask to board
edge spacing
See diagram... 40 mil. 28 mil.
Maximum peel-off mask filled hole See diagram... 71 mil. 79 mil.
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minimum 0,5 MOhm Minimum 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Ionic contamination spacer Max. 1g Eq. CINa/cm2 Max. 0,8 g Eq. CINa/cm2
Other features spacer See spec.
IPC-A-600 Rev.E 8-95
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Last update: 01-12-2014
Units: Mils