PARAMETERS MANUFACTURE MULTILAYER
CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter See diagram... 20 mil 12 mil 12 mil 8 mil 6 mil
Minimum non plated through hole diameter See diagram... 24 mil 16 mil 16 mil 12 mil 10 mil
Aspect / Ratio See diagram... 5 5 6 8 13 (maximun
thickness 80 mils)
Minimum outerlayer trace / spacing width See diagram... 12 mil ( oz)
12 mil (1 oz)
14 mil (2 oz)
8 mil ( oz)
8 mil (1 oz)
10 mil (2 oz)
6 mil ( oz)
6 mil (1 oz)
8 mil (2 oz)
5 mil ( oz)
6 mil (1 oz)
7 mil (2 oz)
4 mil ( oz)
Minimum innerlayer trace / spacing width See diagram... 10 mil ( oz)
12 mil (1 oz)
12 mil (2 oz)
6 mil ( oz)
8 mil (1 oz)
8 mil (2 oz)
5 mil ( oz)
6 mil (1 oz)
7 mil (2 oz)
4 mil ( oz)
5 mil (1 oz)
6 mil (2 oz)
3 mil ( oz)
4 mil (1 oz)
Minimum Outer layer annular ring See diagram... 9 mil 7 mil 5 mil 4 mil 3 mil
Minimum Signal inner layer annular ring See diagram... 10 mil 9 mil 8 mil 6 mil 5 mil
Minimum annular spacing in ground plane See diagram... 16 mil 16 mil 12 mil 10 mil 8 mil
Minimum microvia diameter See diagram... 4 mil
(max. thickness
4 mils)
3 mil
(max. thickness
3 mils)
3 mil
(max. thickness 3 mils)
Microvia surface pad See diagram... 14 mil 12 mil 10 mil
Microvia landing pad See diagram... 12 mil 10 mil 10 mil
Minimum wall between
microvia and through hole / blind/ buried
See diagram... 9 mil 6 mil 4 mil
Minimum wall between microvias See diagram... 9 mil 6 mil 4 mil
Minimum wall between microvias into consecutive levels See diagram... 9 mil 6 mil 4 mil


Last update: 13-02-2012
Units: Mils