PARAMETERS MANUFACTURE MULTILAYER
CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter See diagram... 0,50 mm
0,30 mm 0,30 mm
0,20 mm 0,15 mm
Minimum non plated through hole diameter See diagram... 0,60 mm 0,40 mm 0,40 mm 0,30 mm 0,25 mm
Aspect / Ratio See diagram... 5 5 6 8 13 (maximun
thickness 2 mm)
Minimum outerlayer trace / spacing width See diagram... 0,30 mm (17 m)
0,30 mm (35 m)
0,35 mm (70 m)
0,20 mm (17 m)
0,20 mm (35 m)
0,25 mm (70 m)
0,15 mm (17 m)
0,15 mm (35 m)
0,20 mm (70 m)
0,125 mm (17 m)
0,15 mm (35 m)
0,175 mm (70 m)
0,100 mm (17 )
Minimum innerlayer trace / spacing width See diagram... 0,25 mm (17 m)
0,30 mm (35 m)
0,30 mm (70 m)
0,15 mm (17 m)
0,20 mm (35 m)
0,20 mm (70 m)
0,125 mm (17 m)
0,15 mm (35 m)
0,175 mm (70 m)
0,10 mm (17 m)
0,125 mm (35 m)
0,15 mm (70 m)
0,075 mm (17 m)
0,100 mm (35 m)
Minimum Outer layer annular ring See diagram... 0.22 mm 0.17 mm 0.13 mm 0.10 mm 0.075 mm
Minimum Signal inner layer annular ring See diagram... 0.25 mm 0.22 mm 0.19 mm 0.15 mm 0.125 mm
Minimum annular spacing in ground plane See diagram... 0.40 mm 0.40 mm 0.30 mm 0.25 mm 0.20 mm
Minimum microvia diameter See diagram... 0,10 mm
(max. thickness 0.1 mm)
0,075 mm
(max. thickness 0.065 mm)
0,075 mm
(max. thickness
0.065 mm)
Microvia surface pad See diagram... 0.35 mm 0.30 mm 0.25 mm
Microvia landing pad See diagram... 0.30 mm 0.25 mm 0.25 mm
Minimum wall between
microvia and thru hole / blind/ buried
See diagram... 0.22 mm 0.15 mm 0.10 mm
Minimum wall between microvias See diagram... 0.23 mm 0.15 mm 0.10 mm
Minimum wall between microvias in two levels See diagram... 0.23 mm 0.15 mm 0.10 mm


Last update: 13-02-2012
Units: Milimeters