MULTILAYER GENERAL TOLERANCES
STANDARD SPECIAL
Outer layer trace / spacing width Ver esquema... ±25% (35-70 µm)
±20% (17 µm )
±15% (35-70 µm)
±10% (17 µm)
Inner layer trace / spacing width Ver esquema... ±25% (70 µm )
±20% (17-35 µm )
±15% (35-70 µm)
±10% (17 µm)
Plated hole diameter Ver esquema... +0,10 mm / -0,05 mm
(or equivalent)
+0,10 mm / -0,0 mm
(or equivalent)
Non plated hole diameter Ver esquema... +0,10 mm / -0,0 mm
(or equivalent)
±0,035 mm
(or equivalent)
Castellated plated holes Ver esquema... Total thickness circuit.....................>= 0,5 mm
Cross annular ring.......... detall - A >= 0,5 mm
Minimum diameter..........detall - B >= 0,5 mm
Longitudinal annular...... detall - C >= 0,15 mm
Annular separation.........detall - D >= 0,15 mm
Edge separation..............detall - E >= 2 mm
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Backdrill Ver esquema... Min. hole backdrill 0.5mm
More parameters see image
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Scoring to copper clearance Ver esquema... Min. 1,0 mm. Min. 0,75 mm.
Scoring positioning Ver esquema... ±0,10 mm ±0,075 mm
Scoring remaining thickness Ver esquema... ±0,15 mm
±0,075 mm
Board size Ver esquema... ± 0,15 mm.
± 0,10 mm.
Total thickness tolerance Ver esquema... ±10 % ±5 %
Dielectric thickness Ver esquema... ±10 % ±5 %
Finished plated hole copper thickness Ver esquema... Average: 25 µm
Minim: 20 µm
Average: 35 µm
Mínim: 30 µm
Blind/buried plated hole copper thickness Ver esquema... Average: 15 µm
Minimum: 13 µm
Average: 25 µm
Minimum: 20 µm

Microvia Plated hole copper thickness Ver esquema... Average: 12 µm
Minimum:10 µm

Average: 12 µm
Minimum:10 µm
Mínimum wall between same net plated through holes Ver esquema... 0.30 mm 0.25 mm
Minimum wall between different net plated through holes Ver esquema... 0,40 mm. 0,35 mm.
Minimum wall between non plated thruough holes Ver esquema... 0,25 mm. 0,20 mm.
Minimum annular ring non plated hole Ver esquema... 0,25 mm
0,20 mm
Track to non plated through hole minimum spacing Ver esquema... 0,20 mm
0,15 mm
Track to board edge minimum spacing Ver esquema... 0,20 mm
0,15 mm
Offset between board edge and drill Ver esquema... Max. 0,15 mm.
Max. 0,10 mm.
Offset between drill to outlayer pad Ver esquema... Max. 0,10 mm.
Max. 0,075 mm.
Offset between drill to innerlayer pad Ver esquema... Max. 0,15 mm. Max. 0,12 mm.
Offset between layers Ver esquema... Max. 0,10 mm.
Max. 0,075 mm.
Soldermask feature tolerance Ver esquema... Max. 0,15 mm. Max. 0,075 mm.
Soldermask min Dam size on fiber Ver esquema... SOLDERMASK GREEN COLOR
Dam 70µm if final copper thickness is 17÷54µm.
Dam 85µm if final copper thickness is 55÷85µm.
Dam 105µm if final copper thickness is 86÷155µm.
SOLDERMASK WHITE COLOR
Dam 110µm if final copper thickness is 17÷54µm.
Dam 110µm if final copper thickness is 55÷85µm.
Other final copper thickness > 85µm, to consult.
OTHER SOLDERMASK COLORS
Dam 80µm if final copper thickness is 17÷54µm.
Dam 95µm if final copper thickness is 55÷85µm.
Dam 105µm if final copper thickness is 86÷155µm.
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Soldermask min Dam size on copper Ver esquema... SOLDERMASK GREEN COLOR
Dam 60µm if final copper thickness is 17÷54µm.
Dam 70µm if final copper thickness is 55÷85µm.
Dam 85µm if final copper thickness is 86÷155µm.
SOLDERMASK WHITE COLOR
Dam 110µm if final copper thickness is 17÷54µm.
Dam 110µm if final copper thickness is 55÷85µm.
Other final copper thickness > 85µm, to consult.
OTHER SOLDERMASK COLORS
Dam 70µm if final copper thickness is 17÷54µm.
Dam 80µm if final copper thickness is 55÷85µm.
Dam 90µm if final copper thickness is 86÷155µm.
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Photoimageable soldermask clearance Ver esquema... 0.06 mm --
Silkscreened soldermask clearance Ver esquema... 0,20 mm
0,15 mm
Legend minimum line Ver esquema... 0,125 mm
0,10 mm
Conductive ink (graphite) overlapping Ver esquema... 0,20 mm
0,125 mm
Conductive ink (graphite) spacing Ver esquema... 0,50 mm 0,40 mm
Conductive ink to pad spacing Ver esquema... 0,40 mm 0,30 mm
Peel-off mask overlapping Ver esquema... 0.8 mm
0,50 mm
Peel-off mask to pad spacing Ver esquema... 1 mm 0,70 mm
Peel-off mask to board
edge spacing
Ver esquema... 1 mm 0,70 mm
Maximum peel-off mask filled hole Ver esquema... 1.80 mm 2 mm
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minim 0,5 MOhm Minim 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Ionic contamination spacer Max. 0.4 µg Eq. NaCl/cm² Max. 0.4 µg Eq. NaCl/cm²
Other features spacer See spec.
IPC-A-600 Rev K jul-20
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Last update: 13-06-2023
Units: Milimeters