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LAB CIRCUITS, SA PRINTED CIRCUIT BOARD MANUFACTURING

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Features manufacture multilayer and General tolerances


PARAMETERS MANUFACTURE MULTILAYER


Last update: 13-02-2012
Units: Milimeters


[Display using MILS]

CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter Minimum plated through hole diameter 0,50 mm
0,30 mm 0,30 mm
0,20 mm 0,15 mm
Minimum non plated through hole diameter Minimum non plated through hole diameter 0,60 mm 0,40 mm 0,40 mm 0,30 mm 0,25 mm
Aspect / Ratio Aspect/Ratio 5 5 6 8 13 (maximun
thickness 2 mm)
Minimum outerlayer trace / spacing width Minimum outerlayer trace/spacing width 0,30 mm (17 m)
0,30 mm (35 m)
0,35 mm (70 m)
0,20 mm (17 m)
0,20 mm (35 m)
0,25 mm (70 m)
0,15 mm (17 m)
0,15 mm (35 m)
0,20 mm (70 m)
0,125 mm (17 m)
0,15 mm (35 m)
0,175 mm (70 m)
0,100 mm (17 )
Minimum innerlayer trace / spacing width Minimum innerlayer trace/spacing width 0,25 mm (17 m)
0,30 mm (35 m)
0,30 mm (70 m)
0,15 mm (17 m)
0,20 mm (35 m)
0,20 mm (70 m)
0,125 mm (17 m)
0,15 mm (35 m)
0,175 mm (70 m)
0,10 mm (17 m)
0,125 mm (35 m)
0,15 mm (70 m)
0,075 mm (17 m)
0,100 mm (35 m)
Minimum Outer layer annular ring Minimum Outer layer annular ring 0.22 mm 0.17 mm 0.13 mm 0.10 mm 0.075 mm
Minimum Signal inner layer annular ring Minimum Signal inner layer annular ring 0.25 mm 0.22 mm 0.19 mm 0.15 mm 0.125 mm
Minimum annular spacing in ground plane Minimum annular spacing in ground plane 0.40 mm 0.40 mm 0.30 mm 0.25 mm 0.20 mm
Minimum microvia diameter Minimum microvia diameter 0,10 mm
(max. thickness 0.1 mm)
0,075 mm
(max. thickness 0.065 mm)
0,075 mm
(max. thickness
0.065 mm)
Microvia surface pad Microvia surface pad 0.35 mm 0.30 mm 0.25 mm
Microvia landing pad Microvia landing pad 0.30 mm 0.25 mm 0.25 mm
Minimum wall between
microvia and thru hole / blind/ buried
Minimum wall between 
microvia and thru hole / blind/ buried 0.22 mm 0.15 mm 0.10 mm
Minimum wall between microvias Minimum wall between microvias 0.23 mm 0.15 mm 0.10 mm
Minimum wall between microvias in two levels Minimum wall between microvias into consecutive levels 0.23 mm 0.15 mm 0.10 mm

 

High level complexity and minimizing the space for the printed circuit boards have been the main reasons for the strong development of multiple layers printed circuit boards. The increase in the manufacturing of this kind of printed circuit boards has been constant in Lab Circuits during the last years. The classic structure of a multiple layers printed circuit board has some cores that have the ground and signal inner layers- and the conventional component and solder faces in the outside. The cores are made by a FR4 material sheet (glass fibre and epoxy resin with two external copper layers).

The core has its own body in the manufacture process until the multilayer pressing moment takes part, this means, it goes through a dry film process, exposure and a chemical process to end up creating one only structure that combines the cores with the prepreg sheets (glass fibre fabric impregnated with epoxy resin) and external covering copper sheets. This union is achieved by high temperature lamination pressing process.

Once it has been pressed, this structure has the same process as a double-sided printed circuit board.



MULTILAYER GENERAL TOLERANCES


Last update: 20-09-2016
Units: Milimeters


[Display using MILS]

STANDARD SPECIAL
Outer layer trace / spacing width Outer layer trace/spacing width 25% (35-70 m)
20% (17 m )
15% (35-70 m)
10% (17 m)
Inner layer trace / spacing width Inner layer trace/spacing width 25% (70 m )
20% (17-35 m )
15% (35-70 m)
10% (17 m)
Plated hole diameter Plated hole diameter +0,10 mm / -0,05 mm
(or equivalent)
+0,10 mm / -0,0 mm
(or equivalent)
Non plated hole diameter Non plated hole diameter +0,10 mm / -0,0 mm
(or equivalent)
0,035 mm
(or equivalent)
Scoring to copper clearance Scoring to copper clearance Min. 1,0 mm. Min. 0,75 mm.
Scoring positioning Scoring positioning 0,10 mm 0,075 mm
Scoring remaining thickness Scoring remaining thickness 0,15 mm
0,075 mm
Board size Board size 0,15 mm.
0,10 mm.
Total thickness tolerance Total thickness tolerance 10 % 5 %
Dielectric thickness Dielectric thickness 10 % 5 %
Finished plated hole copper thickness Finished plated hole copper thickness Average: 25 m
Minim: 20 m
Average: 35 m
Mnim: 30 m
Blind/buried plated hole copper thickness Blind/buried plated hole copper thickness Average: 15 m
Minimum: 13 m
Average: 25 m
Minimum: 20 m

Microvia Plated hole copper thickness Microvia Plated hole copper thickness Average: 12 m
Minimum:10 m

Average: 12 m
Minimum:10 m
Mnimum wall between same net plated through holes Mnimum wall between same net plated through holes 0.30 mm 0.25 mm
Minimum wall between different net plated through holes Minimum wall between different net plated through holes 0,40 mm. 0,35 mm.
Minimum wall between non plated thruough holes Minimum wall between non plated thruough holes 0,25 mm. 0,20 mm.
Minimum annular ring non plated hole Minimum annular ring non plated hole 0,25 mm
0,20 mm
Track to non plated through hole minimum spacing Track to non plated through hole minimum spacing 0,20 mm
0,15 mm
Track to board edge minimum spacing Track to board edge minimum spacing 0,20 mm
0,15 mm
Offset between board edge and drill Offset between board edge and drill Max. 0,15 mm.
Max. 0,10 mm.
Offset between drill to outlayer pad Offset between drill to outlayer pad Max. 0,10 mm.
Max. 0,075 mm.
Offset between drill to innerlayer pad Offset between drill to innerlayer pad Max. 0,15 mm. Max. 0,12 mm.
Offset between layers Offset between layers Max. 0,10 mm.
Max. 0,075 mm.
Soldermask feature tolerance Soldermask feature tolerance Max. 0,15 mm. Max. 0,075 mm.
Soldermask min Dam size Soldermask min Dam size 0.08 mm green color
other colors on request
--
Photoimageable soldermask clearance Photoimageable soldermask clearance 0.06 mm --
Silkscreened soldermask clearance Silkscreened soldermask clearance 0,20 mm
0,15 mm
Legend minimum line Legend minimum line 0,125 mm
0,10 mm
Conductive ink (graphite) overlapping Conductive ink (graphite) overlapping 0,20 mm
0,125 mm
Conductive ink (graphite) spacing Conductive ink (graphite) spacing 0,50 mm 0,40 mm
Conductive ink to pad spacing Conductive ink to pad spacing 0,40 mm 0,30 mm
Peel-off mask overlapping Peel-off mask overlapping 0.8 mm
0,50 mm
Peel-off mask to pad spacing Peel-off mask to pad spacing 1 mm 0,70 mm
Peel-off mask to board
edge spacing
Peel-off mask to board 
edge spacing 1 mm 0,70 mm
Maximum peel-off mask filled hole Maximum peel-off mask filled hole 1.80 mm 2 mm
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minim 0,5 MOhm Minim 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Ionic contamination spacer Max. 1g Eq. CINa/cm2 Max. 0,8 g Eq. CINa/cm2
Other features spacer See spec.
IPC-A-600 Rev.G jul-04
-

 

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