CAT • ESP • ENG • FRA • ITA • DEU
LAB CIRCUITS, SA · PRINTED CIRCUIT BOARD MANUFACTURING

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Features manufacture double-side and General tolerances

PARAMETERS MANUFACTURE DOUBLE SIDE


Last update: 19-05-2007
Units: Mils


[Display using MILIMETERS]

CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter Minimum plated through hole diameter 20 mil 12 mil 12 mil 8 mil 6 mil
Minimum non plated through hole diameter Minimum non plated through hole diameter 24 mil 16 mil 16 mil 12 mil 10 mil
Aspect / Ratio Aspect/Ratio 5 5 6 8 13 (maximum
thickness 2 mm)
Minimum trace / spacing width Minimum trace/spacing width 12 mil (½ oz )
12 mil (1 oz )
14 mil (2 oz )
8 mil (½ oz )
8 mil (1 oz )
10 mil (2 oz )
6 mil (½ oz )
6 mil (1 oz )
8 mil (2 oz )
5 mil (½ oz )
6 mil (1 oz )
7 mil (2 oz )
4 mil (½ oz )

Minimum annular ring
Minimum annular ring
9 mil 7 mil 5 mil 4 mil 3 mils

 


We classify the circuit difficulty in accordance with the next parameters:

- CLASS.
Dimensional characteristics of the different elements that form the image of the printed circuit board.

- RING CHECK
Copper ring between de hole and the pad. This parameter determinates the alignment difficulty between the hole and the printed circuit board image.

- TOLERANCES
Tolerance level of the different proceedings and materials.

The sum of these three items will define the manufacture difficulty and therefore the price of the printed circuit board.

 


BILAYER GENERAL TOLERANCES


Last update: 01-12-2014
Units: Mils


[Display using MILIMETERS]

STANDARD SPECIAL
Trace / spacing width Trace/spacing width ±20% (½ oz )
±25% (1-2 oz )
±10% (½ oz )
±15% (1 - 2 oz)
Plated hole diameter Plated hole diameter +4 mil / -2 mil
(or equivalent)
+4 mil / -0,0 mil
±2 mil
Non plated hole diameter Non plated hole diameter +4 mil / -0,0 mil
(or equivalent)
±1.4 mil
(or equivalent)
Scoring to copper clearance Scoring to copper clearance Min. 40 mil. Min. 30 mil
Scoring positioning Scoring positioning ± 4 mil ± 3 mil
Scoring remaining thickness Scoring remaining thickness ± 4 mil
± 2 mil
Board size Board size ± 6 mil.
± 4 mil.
Total thickness tolerance Total thickness tolerance ±10 % ±5 %
Finished plated hole copper thickness Finished plated hole copper thickness Average: 0.7 oz
Minimum: 0.6 oz
Average: 1 oz
Minimum: 0.86 oz
Minimum wall between same net plated through holes Mνnimum wall between same net plated through holes 12 mil. 10 mil.
Minimum wall between different net plated through holes Minimum wall between different net plated through holes 16 mil. 14 mil.
Minimum wall between non plated through holes Minimum wall between non plated through holes 10 mil. 8 mil.
Minimum annular ring non plated hole Minimum annular ring non plated hole 10 mil.
8 mil.
Track to non plated through hole minimum spacing Track to non plated through hole minimum spacing 8 mil. 6 mil.
Conductor to board edge
minimum spacing
Track to board edge minimum spacing 8 mil. 6 mil.
Offset between board edge and drill Offset between board edge and drill Max. 6 mil.
Max. 4 mil.
Offset between drill to outlayer pad Offset between drill to outlayer pad Max. 4 mil.
Max. 3 mil.
Soldermask feature tolerance Soldermask feature tolerance Max. 6 mil. Max. 3 mil.
Soldermask minimum Dam size Soldermask minimum Dam size 3.15 mil. green color
other colors on request
-
Photoimageable soldermask clearance Photoimageable soldermask clearance 3 mil. 2.36 mil.
Silkscreened soldermask clearance Silkscreened soldermask clearance 8 mil. 6 mil.
Legend minimum line Legend minimum line 5 mil. 4 mil.
Conductive ink (graphite) overlapping Conductive ink (graphite) overlapping 8 mil.
5 mil.
Conductive ink (graphite) spacing Conductive ink (graphite) spacing 20 mil. 16 mil.
Conductive ink to pad spacing Conductive ink to pad spacing 16 mil. 12 mil.
Peel-off mask overlapping Peel-off mask overlapping 32 mil. 20 mil.
Peel-off mask to pad spacing Peel-off mask to pad spacing 40 mil. 28 mil.
Peel-off mask to board
edge spacing
Peel-off mask to board 
edge spacing 40 mil. 28 mil.
Maximum peel-off mask filled hole Maximum peel-off mask filled hole 71 mil. 79 mil.
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minimum 0,5 MOhm Minimum 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Ionic contamination spacer Max. 1΅g Eq. CINa/cm2 Max. 0,8 ΅g Eq. CINa/cm2
Other features spacer See spec.
IPC-A-600 Rev.E 8-95
-

 

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