CAT • ESP • ENG • FRA • ITA • DEU
LAB CIRCUITS, SA · PRINTED CIRCUIT BOARD MANUFACTURING

spacer spacer
spacer spacer
   
Products
spacer spacer
spacer
   
Multilayer circuit boards
spacer
spacer
   
Double-side circuit boards
spacer
   
Rigiflex
spacer
   
Budget request
spacer
spacer
spacer

Features manufacture double-side and General tolerances

PARAMETERS MANUFACTURE DOUBLE SIDE


Last update: 19-06-2007
Units: Milimeters


[Display using MILS]

CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter Minimum plated through hole diameter 0,50 mm 0,30 mm 0,30 mm 0,20 mm 0,15 mm
Minimum non plated through hole diameter Minimum non plated through hole diameter 0,60 mm 0,40 mm 0,40 mm 0,30 mm 0,25 mm
Aspect / Ratio Aspect/Ratio 5 5 6 8 13
(maximum
thickness 2 mm)
Minimum trace / spacing width Minimum trace/spacing width 0,30 mm (17 µ )
0,30 mm (35 µ )
0,35 mm ( 70 µ )
0,20 mm (17 µ )
0,20 mm (35 µ )
0,25 mm ( 70 µ )
0,150 mm (17 µ)
0,150 mm (35 µ)
0,200 mm (70 µ )
0,125 mm (17 µ)
0,150 mm (35 µ)
0,175 mm (70 µ )
0,100 mm (17 µ)
Minimum annular ring
Minimum annular ring
0.22 mm 0.17 mm 0.13mm 0.10mm 0.075 mm

 


We classify the circuit difficulty in accordance with the next parameters:

- CLASS.
Dimensional characteristics of the different elements that form the image of the printed circuit board.

- RING CHECK
Copper ring between de hole and the pad. This parameter determinates the alignment difficulty between the hole and the printed circuit board image.

- TOLERANCES
Tolerance level of the different proceedings and materials.

The sum of these three items will define the manufacture difficulty and therefore the price of the printed circuit board.

 


BILAYER GENERAL TOLERANCES


Last update: 01-12-2014
Units: Milimeters


[Display using MILS]

STANDARD SPECIAL
Trace / spacing width
(thickness copper foil)
Trace/spacing width (thickness  copper foil) ±25% (35-70 µm)
±20% (17 µm )
±15% (35-70 µm)
±10% (17 µm)
Plated hole diameter Plated hole diameter +0,10 mm / -0,05 mm
(or equivalent)
+0,10 mm / -0,0 mm
(or equivalent)
Non plated hole diameter Non plated hole diameter +0,10 mm / -0,0 mm
(or equivalent)
±0,035 mm
(or equivalent)
Scoring to copper clearance Scoring to copper clearance Min. 1,0 mm. Min. 0,75 mm.
Scoring positioning Scoring positioning ±0,10 mm ±0,075 mm
Scoring remaining thickness Scoring remaining thickness ±0,15 mm
±0,075 mm
Board size Board size ± 0,15 mm.
± 0,10 mm.
Total thickness tolerance Total thickness tolerance ±10 % ±5 %
Finished plated hole copper thickness Finished plated hole copper thickness Average: 25 µm
Minim: 20 µm
Average: 35 µm
Mínim: 30 µm
Mínimum wall between same net plated through holes Mínimum wall between same net plated through holes 0.30 mm 0.25 mm
Minimum wall between different net plated through holes Minimum wall between different net plated through holes 0,40 mm. 0,35 mm.
Minimum wall between non plated through holes Minimum wall between non plated through holes 0,25 mm. 0,20 mm.
Minimum annular ring non plated hole Minimum annular ring non plated hole 0,25 mm
0,20 mm
Track to non plated through hole minimum spacing Track to non plated through hole minimum spacing 0,20 mm
0,15 mm
Track to board edge minimum spacing Track to board edge minimum spacing 0,20 mm
0,15 mm
Offset between board edge and drill Offset between board edge and drill Max. 0,15 mm.
Max. 0,10 mm.
Drill to pad misalingnement Offset between drill to outlayer pad Max. 0,10 mm.
Max. 0,075 mm.
Soldermask feature tolerance Soldermask feature tolerance Max. 0,15 mm. Max. 0,075 mm.
Soldermask min Dam size Soldermask minimum Dam size 0.08 mm green color
other colors on request
--
Photoimageable soldermask clearance Photoimageable soldermask clearance 0,07 mm
0.06 mm
Silkscreened soldermask clearance Silkscreened soldermask clearance 0,20 mm
0,15 mm
Legend minimum line Legend minimum line 0,125 mm
0,10 mm
Conductive ink (graphite) overlapping Conductive ink (graphite) overlapping 0,20 mm
0,125 mm
Conductive ink (graphite) spacing Conductive ink (graphite) spacing 0,50 mm 0,40 mm
Conductive ink to pad spacing Conductive ink to pad spacing 0,40 mm 0,30 mm
Peel-off mask overlapping Peel-off mask overlapping 0.8 mm
0,50 mm
Peel-off mask to pad spacing Peel-off mask to pad spacing 1 mm 0,70 mm
Peel-off mask to board
edge spacing
Peel-off mask to board 
edge spacing 1 mm 0,70 mm
Maximum peel-off mask filled hole Maximum peel-off mask filled hole 1.8 mm 2 mm
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minim 0,5 MOhm Minim 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Ionic contamination spacer Max. 1µg Eq. CINa/cm2 Max. 0,8 µg Eq. CINa/cm2
For other features spacer See spec.
IPC-A-600 Rev.G jul-04
-

 

[top]

spacer spacer