Features manufacture double-side

PARAMETERS MANUFACTURE DOUBLE SIDE

		CLASS 3	CLASS 4	CLASS 5	CLASS 6	CLASS 7
Minimum plated through hole diameter		0,50 mm	0,30 mm	0,30 mm	0,20 mm	0,15 mm
Minimum non plated through hole diameter		0,60 mm	0,40 mm	0,40 mm	0,30 mm	0,25 mm
Aspect/Ratio		5	5	6	8	13 (maximum thickness 2 mm)
Minimum trace/spacing width		0,30 mm (17 µ ) 0,30 mm (35 µ ) 0,35 mm ( 70 µ )	0,20 mm (17 µ ) 0,20 mm (35 µ ) 0,25 mm ( 70 µ )	0,150 mm (17 µ) 0,150 mm (35 µ) 0,200 mm (70 µ )	0,125 mm (17 µ) 0,150 mm (35 µ) 0,175 mm (70 µ )	0,100 mm (17 µ)
Minimum annular ring		0.22 mm	0.17 mm	0.13mm	0.10mm	0.075 mm

We classify the circuit difficulty in accordance with the next parameters:

- CLASS.
Dimensional characteristics of the different elements that form the image of the printed circuit board.

- RING CHECK
Copper ring between de hole and the pad. This parameter determinates the alignment difficulty between the hole and the printed circuit board image.

- TOLERANCES
Tolerance level of the different proceedings and materials.

The sum of these three items will define the manufacture difficulty and therefore the price of the printed circuit board.