Double-side

Features manufacture double-side and General tolerances

We classify the circuit difficulty in accordance with the next parameters:

CLASS

Dimensional characteristics of the different elements that form the image of the printed circuit board.

RING CHECK

Copper ring between de hole and the pad. This parameter determinates the alignment difficulty between the hole and the printed circuit board image.

TOLERANCES

Tolerance level of the different proceedings and materials.

The sum of these three items will define the manufacture difficulty and therefore the price of the printed circuit board.

PARAMETERS MANUFACTURE DOUBLE SIDE

CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter 0,50 mm 0,30 mm 0,30 mm 0,20 mm 0,15 mm
Minimum non plated through hole diameter 0,60 mm 0,40 mm 0,40 mm 0,30 mm 0,25 mm
Aspect / Ratio 5 5 6 8 13
(maximum
thickness 2 mm)
Minimum trace / spacing width 0,30 mm (17 µ )
0,30 mm (35 µ )
0,35 mm ( 70 µ )
0,20 mm (17 µ )
0,20 mm (35 µ )
0,25 mm ( 70 µ )
0,150 mm (17 µ)
0,150 mm (35 µ)
0,200 mm (70 µ )
0,125 mm (17 µ)
0,150 mm (35 µ)
0,175 mm (70 µ )
0,100 mm (17 µ)
Minimum annular ring
0.22 mm 0.17 mm 0.13mm 0.10mm 0.075 mm

Last update: 19-06-2007
Units: Milimeters

CLASS 3 CLASS 4 CLASS 5 CLASS 6 CLASS 7
Minimum plated through hole diameter Minimum plated through hole diameter 20 mil 12 mil 12 mil 8 mil 6 mil
Minimum non plated through hole diameter Minimum non plated through hole diameter 24 mil 16 mil 16 mil 12 mil 10 mil
Aspect / Ratio Aspect/Ratio 5 5 6 8 13 (maximum
thickness 2 mm)
Minimum trace / spacing width Minimum trace/spacing width 12 mil (½ oz )
12 mil (1 oz )
14 mil (2 oz )
8 mil (½ oz )
8 mil (1 oz )
10 mil (2 oz )
6 mil (½ oz )
6 mil (1 oz )
8 mil (2 oz )
5 mil (½ oz )
6 mil (1 oz )
7 mil (2 oz )
4 mil (½ oz )

Minimum annular ring
Minimum annular ring
9 mil 7 mil 5 mil 4 mil 3 mils

Last update: 19-05-2007
Units: Mils

BILAYER GENERAL TOLERANCES

STANDARD SPECIAL
Trace / spacing width
(thickness copper foil)
±25% (35-70 µm)
±20% (17 µm )
±15% (35-70 µm)
±10% (17 µm)
Plated hole diameter +0,10 mm / -0,05 mm
(or equivalent)
+0,10 mm / -0,0 mm
(or equivalent)
Non plated hole diameter +0,10 mm / -0,0 mm
(or equivalent)
±0,035 mm
(or equivalent)
Scoring to copper clearance Min. 1,0 mm. Min. 0,75 mm.
Scoring positioning ±0,10 mm ±0,075 mm
Scoring remaining thickness ±0,15 mm
±0,075 mm
Board size ± 0,15 mm.
± 0,10 mm.
Total thickness tolerance ±10 % ±5 %
Finished plated hole copper thickness Average: 25 µm
Minim: 20 µm
Average: 35 µm
Mínim: 30 µm
Mínimum wall between same net plated through holes 0.30 mm 0.25 mm
Minimum wall between different net plated through holes 0,40 mm. 0,35 mm.
Minimum wall between non plated through holes 0,25 mm. 0,20 mm.
Minimum annular ring non plated hole 0,25 mm
0,20 mm
Track to non plated through hole minimum spacing 0,20 mm
0,15 mm
Track to board edge minimum spacing 0,20 mm
0,15 mm
Offset between board edge and drill Max. 0,15 mm.
Max. 0,10 mm.
Drill to pad misalingnement Max. 0,10 mm.
Max. 0,075 mm.
Soldermask feature tolerance Max. 0,15 mm. Max. 0,075 mm.
Soldermask min Dam size 0.08 mm green color
other colors on request
--
Photoimageable soldermask clearance 0,07 mm
0.06 mm
Silkscreened soldermask clearance 0,20 mm
0,15 mm
Legend minimum line 0,125 mm
0,10 mm
Conductive ink (graphite) overlapping 0,20 mm
0,125 mm
Conductive ink (graphite) spacing 0,50 mm 0,40 mm
Conductive ink to pad spacing 0,40 mm 0,30 mm
Peel-off mask overlapping 0.8 mm
0,50 mm
Peel-off mask to pad spacing 1 mm 0,70 mm
Peel-off mask to board
edge spacing
1 mm 0,70 mm
Maximum peel-off mask filled hole 1.8 mm 2 mm
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minim 0,5 MOhm Minim 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Ionic contamination spacer Max. 1µg Eq. CINa/cm2 Max. 0,8 µg Eq. CINa/cm2
For other features spacer See spec.
IPC-A-600 Rev.G jul-04
-

Last update: 01-12-2014
Units: Milimeters

STANDARD SPECIAL
Trace / spacing width Trace/spacing width ±20% (½ oz )
±25% (1-2 oz )
±10% (½ oz )
±15% (1 - 2 oz)
Plated hole diameter Plated hole diameter +4 mil / -2 mil
(or equivalent)
+4 mil / -0,0 mil
±2 mil
Non plated hole diameter Non plated hole diameter +4 mil / -0,0 mil
(or equivalent)
±1.4 mil
(or equivalent)
Scoring to copper clearance Scoring to copper clearance Min. 40 mil. Min. 30 mil
Scoring positioning Scoring positioning ± 4 mil ± 3 mil
Scoring remaining thickness Scoring remaining thickness ± 4 mil
± 2 mil
Board size Board size ± 6 mil.
± 4 mil.
Total thickness tolerance Total thickness tolerance ±10 % ±5 %
Finished plated hole copper thickness Finished plated hole copper thickness Average: 0.7 oz
Minimum: 0.6 oz
Average: 1 oz
Minimum: 0.86 oz
Minimum wall between same net plated through holes Mínimum wall between same net plated through holes 12 mil. 10 mil.
Minimum wall between different net plated through holes Minimum wall between different net plated through holes 16 mil. 14 mil.
Minimum wall between non plated through holes Minimum wall between non plated through holes 10 mil. 8 mil.
Minimum annular ring non plated hole Minimum annular ring non plated hole 10 mil.
8 mil.
Track to non plated through hole minimum spacing Track to non plated through hole minimum spacing 8 mil. 6 mil.
Conductor to board edge
minimum spacing
Track to board edge minimum spacing 8 mil. 6 mil.
Offset between board edge and drill Offset between board edge and drill Max. 6 mil.
Max. 4 mil.
Offset between drill to outlayer pad Offset between drill to outlayer pad Max. 4 mil.
Max. 3 mil.
Soldermask feature tolerance Soldermask feature tolerance Max. 6 mil. Max. 3 mil.
Soldermask minimum Dam size Soldermask minimum Dam size 3.15 mil. green color
other colors on request
-
Photoimageable soldermask clearance Photoimageable soldermask clearance 3 mil. 2.36 mil.
Silkscreened soldermask clearance Silkscreened soldermask clearance 8 mil. 6 mil.
Legend minimum line Legend minimum line 5 mil. 4 mil.
Conductive ink (graphite) overlapping Conductive ink (graphite) overlapping 8 mil.
5 mil.
Conductive ink (graphite) spacing Conductive ink (graphite) spacing 20 mil. 16 mil.
Conductive ink to pad spacing Conductive ink to pad spacing 16 mil. 12 mil.
Peel-off mask overlapping Peel-off mask overlapping 32 mil. 20 mil.
Peel-off mask to pad spacing Peel-off mask to pad spacing 40 mil. 28 mil.
Peel-off mask to board
edge spacing
Peel-off mask to board 
edge spacing 40 mil. 28 mil.
Maximum peel-off mask filled hole Maximum peel-off mask filled hole 71 mil. 79 mil.
Bow and twist spacer Maxim 1% Maxim 0,5 %
Insulation resistance spacer Minimum 0,5 MOhm Minimum 2,0 MOhm
Continuity spacer Maxim 10 Ohms -
Ionic contamination spacer Max. 1µg Eq. CINa/cm2 Max. 0,8 µg Eq. CINa/cm2
Other features spacer See spec.
IPC-A-600 Rev.E 8-95
-

Last update: 01-12-2014
Units: Mils